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Tin/Lead Alloy Spherical Powder (Sn50/Pb50)

Available Configurations

Properties common to all products in this list

Composition: Sn 50/Pb 50 Form: Powder Material: Tin/Lead Commodity: Alloys Max Particle Size: 75μm
Tin/Lead Alloy Spherical Powder (Sn50/Pb50) offers a balanced composition of tin’s corrosion resistance and wettability with lead’s ductility and stability, yielding a versatile solder alloy. The spherical particle shape ensures uniform flow, consistent melting, and high packing density in powder-based processes. Industries such as electronics, additive manufacturing, and coating production use this alloy for solder pastes, printed circuit board assembly, and thick-film electronics. Specific applications include reflow soldering in mixed-technology boards, conductive adhesive formulations, and specialized coating deposition methods. The powder form is optimized for automated dispensing, ensuring reproducibility and uniformity in both small-scale and high-volume applications.
Starting at $271.00 each
No Minimum order Free technical support *Free delivery worldwide

Material Properties

Thermal Properties
Element Value
Melting point( C ) 183-216
each

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Available Configurations

Properties common to all products in this list

Composition: Sn 50/Pb 50 Form: Powder Material: Tin/Lead Commodity: Alloys Max Particle Size: 75μm

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Tolerances

Powder
Mean Particle Size Nominal
Minimum Particle Size Nominal
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Particle Size D10 Nominal
Particle Size D50 Nominal
Particle Size D90 Nominal