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Formula: Sn 60/Pb 39/Sb 1
Form: Foil/Film/Sheet
Material: Tin/Lead/Antimony
Commodity: Alloys

Tin/Lead/Antimony Alloy Foil (Sn60/Pb39/Sb1)

Tin/Lead/Antimony Alloy Foil (Sn60/Pb39/Sb1) retains the mechanical and soldering benefits of the light-tight variant but without the requirement for complete light impermeability. It offers excellent flow characteristics during soldering, enhanced mechanical strength from antimony, and good corrosion resistance from tin. Industries such as electrical engineering, industrial manufacturing, and precision assembly use this alloy for producing durable solder joints, making wear-resistant mechanical parts, and manufacturing alloy-based coatings. Specific applications include fabricating connectors, producing bearing overlays, and constructing vibration-resistant joints. The foil format allows for uniform application, clean cutting, and reproducible bonding performance.
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Tolerances

Foil
Thickness <0.01mm ±25%
Thickness 0.01mm - 0.05mm ±25%
Thickness >0.05mm ±10%

Material Properties for Alloys

Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 14.8
Thermal Properties
Element Value
Melting point( C ) 183
Thermal conductivity( W m⁻¹ K⁻¹ ) 50.2@23
Thermal conductivity( W m⁻¹ K⁻¹ ) 50.2@23C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 24@15-110°C
Physical Properties
Element Value
Density( gcm⁻³ ) 8.42

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