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Formula: Si
Form: Rod
Material: Silicon
CAS Number: 7440-21-3
Commodity: Metals
Purity: 99.999%
Structure: Crystalline
Silicon Rod combines high purity, structural integrity, and controlled crystallinity, making it a preferred form for zone refining, crystal growth, and semiconductor manufacturing. Its rod geometry supports processes such as the Czochralski and float-zone methods, enabling the production of defect-free single crystals for microelectronics and photovoltaic applications. Industries including semiconductors, optics, and energy storage use silicon rods for wafer production, optical component substrates, and research into advanced battery anodes. Specific applications include manufacturing monocrystalline wafers for integrated circuits, producing precision optical mirrors, and experimental synthesis of silicon-based composites. In research, silicon rods enable precise studies of crystal defects, doping behavior, and thermal conductivity in bulk silicon. Their role in enabling ultra-pure silicon production underscores their industrial and scientific importance.
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Tolerances

Rod
Diameter =<10mm ±10%
Diameter >10mm ±5%

Material Properties for Metals

Atomic Properties
Element Value
Atomic number 14
Crystal structure Diamond
Electronic structure Ne 3s² 3p²
Valences shown 4
Atomic weight( amu ) 28.0855
Thermal neutron absorption cross-section( Barns ) 0.16
Photo-electric work function( eV ) 4.2
Natural isotope distribution( Mass No./% ) 30/ 3.10
Natural isotope distribution( Mass No./% ) 29/ 4.67
Natural isotope distribution( Mass No./% ) 28/ 92.23
Atomic radius - Goldschmidt( nm ) 0.117
Ionisation potential( No./eV ) 5/ 167
Ionisation potential( No./eV ) 1/ 8.15
Ionisation potential( No./eV ) 2/ 16.3
Ionisation potential( No./eV ) 3/ 33.5
Ionisation potential( No./eV ) 4/ 45.1
Ionisation potential( No./eV ) 6/ 205
Mechanical Properties
Element Value
Hardness - Mohs 7
Material condition Polycrystalline
Poisson's ratio 0.42
Bulk modulus( GPa ) 100
Tensile modulus( GPa ) 113
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 23 x 10¹⁰@20@20°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) -41.56
Physical Properties
Element Value
Boiling point( C ) 2355
Density( gcm⁻³ ) 2.34@20°C
Thermal Properties
Element Value
Melting point( C ) 1410
Latent heat of evaporation( J g⁻¹ ) 13700
Latent heat of fusion( J g⁻¹ ) 1650
Specific heat( J K⁻¹ kg⁻¹ ) 703@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 80-150@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 4.7-7.6@0-100°C

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