Polypropylene Disk

Polypropylene Disk offers excellent chemical resistance, low density, and resistance to stress cracking, making it ideal for applications where lightweight, inert components are needed in corrosive environments. It is widely used in chemical processing, food packaging, and laboratory equipment manufacturing. Specific applications include protective covers in corrosive fluid systems, sample supports in chemical testing setups, and optical masking in reactive processing environments. Its durability against acids, bases, and organic solvents makes it a preferred choice for environments requiring long-term chemical stability. In research, polypropylene disks are employed for studying surface modification techniques, chemical compatibility in experimental setups, and precision machining of polymer components. The combination of chemical stability, machinability, and light weight ensures its utility across scientific and industrial sectors.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Disc

Thickness		±20%

Material Properties for Polymers

Chemical Resistance

Element	Value
Acids - concentrated	Good-Fair
Acids - dilute	Good-Fair
Alcohols	Good
Alkalis	Good
Aromatic hydrocarbons	Fair
Greases and Oils	Good-Fair
Halogenated Hydrocarbons	Good-Poor
Halogens	Poor
Ketones	Good

Mechanical Properties

Element	Value
Coefficient of friction	0.1-0.3
Hardness - Rockwell	R80-100
Elongation at break( % )	150-300, for biax film >50
Tensile modulus( GPa )	0.9-1.5, for biax film 2.2-4.2
Izod impact strength( J m⁻¹ )	20-100
Abrasive resistance - ASTM D1044( mg/1000 cycles )	13-16
Tensile strength( MPa )	25-40, for biax film 130-300,

Electrical Properties

Element	Value
Dielectric constant @1MHz	2.2-2.6
Dissipation factor @ 1MHz	0.0003-0.0005
Dielectric strength( kV mm⁻¹ )	30-40
Surface resistivity( Ohm/sq )	10¹³
Volume resistivity( Ohmcm )	10¹⁶-10¹⁸

Physical Properties

Element	Value
Flammability	HB
Radiation resistance	Fair
Refractive index	1.49
Resistance to Ultra-violet	Poor
Limiting oxygen index( % )	18
Water absorption - equilibrium( % )	0.03
Density( gcm⁻³ )	0.9

Thermal Properties

Element	Value
Heat-deflection temperature - 0.45MPa( C )	100-105
Heat-deflection temperature - 1.8MPa( C )	60-65
Lower working temperature( C )	50
Upper working temperature( C )	90-120
Specific heat( J K⁻¹ kg⁻¹ )	1700-1900
Thermal conductivity( W m⁻¹ K⁻¹ )	0.1-0.22@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	100-180