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Formula: PI
Form: Metallized Film
Material: Polyimide (PI)
CAS Number: 60842-76-4
Commodity: Polymers
Metallized With:
Aluminum - 50-80 nm
Thickness:
0.025mm
Surface Finish:
Metallized On One Side
This PI Film Metallized with Aluminum, also known as polyimide metallized film, is a high-performance material featuring an ultra-thin aluminum layer that provides excellent reflective and conductive properties while maintaining mechanical strength and flexibility. This film is ideal for applications in aerospace, automotive, and telecommunications industries, where it is used for electromagnetic shielding and reflective layers in LED lighting. The polyimide base ensures high thermal stability and chemical resistance, making it suitable for harsh environments. Additionally, the film’s lightweight nature and durability make it a preferred choice for advanced electronic devices and components. Goodfellow offers this advanced material, ensuring it meets the stringent requirements of these high-tech industries. The PI Film Metallized with Aluminum’s unique combination of properties makes it a versatile solution for various demanding applications, and Goodfellow’s commitment to quality guarantees its reliability and performance.
Tolerances
Metallized Film
| Thickness | ±10% |
|---|
Sizes
| Linear dimension | <100mm | ±1mm |
|---|---|---|
| Linear dimension | >=100mm | +2% / -1% |
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Poor |
| Acids - dilute | Fair |
| Alcohols | Poor |
| Alkalis | Poor |
| Aromatic hydrocarbons | Good |
| Greases and Oils | Good |
| Halogenated Hydrocarbons | Good |
| Halogens | Fair |
| Ketones | Good |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.42 |
| Hardness - Rockwell | E52-99 |
| Elongation at break( % ) | Aug-70 |
| Tensile modulus( GPa ) | 02-Mar |
| Izod impact strength( J m⁻¹ ) | 80 |
| Tensile strength( MPa ) | 70-150 |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 3.4 |
| Dissipation factor @ 1kHz | 0.0018 |
| Dielectric strength( kV mm⁻¹ ) | 22 |
| Surface resistivity( Ohm/sq ) | 10¹⁶ |
| Volume resistivity( Ohmcm ) | 10¹⁸ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | V0 |
| Radiation resistance | Good |
| Refractive index | 1.66 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 53 |
| Water absorption - over 24 hours( % ) | 0.2-2.9 |
| Density( gcm⁻³ ) | 1.42 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 1.8MPa( C ) | 360 |
| Lower working temperature( C ) | -270 |
| Upper working temperature( C ) | 250-320 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1090 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.35@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 30-60 |
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