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Polyimide Disk Metallized with Aluminum (50-80 nm)

Available Configurations

Properties common to all products in this list

Composition: PI Form: Metallized Film Material: Polyimide (PI) CAS Number: 60842-76-4 Commodity: Polymers Metallized With: Aluminum - 50-80 nm Thickness: 0.025mm Surface Finish: Metallized On One Side
Diameter Other Variant
4 mm to 50.8 mm Uncoated polyimide

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Polyimide Disk Metallized with Aluminum (50-80 nm) is a precision-cut circular substrate in polyimide film sharing the base chemistry of Kapton® HN, with a vacuum-deposited aluminum layer on one face. It offers comparable thermal service range, electrical insulation, and UL 94 V-0 flammability compliance to Kapton® HN, and suits applications where DuPont-branded substrate specification is not required. The 50-80 nm coating provides greater opacity and conductivity than thinner alternatives, with improved EMI shielding effectiveness and better atomic oxygen protection in low Earth orbit. The disk format suits reflectance measurements, thermal emissivity characterization, metallization adhesion studies, and spacecraft thermal control material qualification trials.
Starting at $311.00 each
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Custom Cutting and Laser Micromachining

For customers requiring custom sizes or finished components rather than raw stock, Goodfellow offers precision cutting and micromachining services to drawing and specification.

Kapton® machined components
Capability Details
Dimensional range Min. thickness: 0.025mm
Max. thickness: 0.125mm
Max. width: 610mm
Dimensional tolerance Linear dimensions ±1mm (<100mm) or +2/-1% (>=100mm)
Volume range Prototype quantities through to several hundred-piece production runs
Lead time Custom sizes: 48 hours to 1 week
Complex geometries: ~2-4 weeks from confirmed drawing
Laser micromachining For complex geometries requiring tight tolerances or intricate features beyond conventional machining, our polyimide film can be processed via laser micromachining through our microfabrication division, with a standard achievable target around 2 µm (tolerance +2/−1 µm)
Technical support Goodfellow can review customer drawings and advise on design improvements for functionality and cost reduction.
To discuss a custom polyimide component, please submit a quote request or contact us and we will come back to you within 48 hours.

Key Features

Polyimide Disk Metallized with Aluminum (50–80 nm) is a precision-cut circular substrate in polyimide film sharing the base chemistry of Kapton® HN, with a vacuum-deposited aluminum layer on one face, offering comparable thermal service range, electrical insulation, and UL 94 V-0 flammability compliance to Kapton® HN for applications where DuPont-branded substrate specification is not required:

50–80 nm Coating Provides Greater Opacity & Conductivity Than Thinner Alternatives

The 50–80 nm aluminum coating provides greater opacity and conductivity than thinner alternatives, with improved EMI shielding effectiveness and better atomic oxygen protection in low Earth orbit compared with 30 nm variants.

Comparable Thermal Service Range & Electrical Insulation to Kapton® HN

The polyimide substrate offers comparable thermal service range, electrical insulation, and UL 94 V-0 flammability compliance to Kapton® HN, suiting it to applications with similar performance requirements where DuPont certification is not specified.

Improved EMI Shielding Effectiveness Over 30 nm Variants

Improved EMI shielding effectiveness over 30 nm variants makes this disk suited to applications requiring stronger electromagnetic attenuation in a precision circular form factor.

Better Atomic Oxygen Protection in Low Earth Orbit

Better atomic oxygen protection than thinner-coated alternatives supports longer service life of this disk in LEO applications where polyimide surfaces are progressively degraded by reactive oxygen species.

Precision Disk Format for Direct-Use in Measurement & Qualification

The precision disk format suits direct use in reflectance measurements, thermal emissivity characterization, metallization adhesion studies, and spacecraft thermal control material qualification trials without further cutting or forming.

Industrial Applications

Polyimide Disk Metallized with Aluminum (50–80 nm) is used across spacecraft thermal control qualification, EMI characterization, and LEO materials research where a thicker aluminum coating and DuPont certification is not required:

Reflectance Measurements & Thermal Emissivity Characterization
Used in reflectance measurements and thermal emissivity characterization, where the precision disk format provides a ready-to-use substrate and the 50–80 nm aluminum coating provides greater opacity than 30 nm variants for more robust optical property measurement.
Metallization Adhesion Studies
Applied in metallization adhesion studies, where the thicker 50–80 nm aluminum layer and the comparable-to-Kapton®-HN polyimide substrate provide an experimental platform for evaluating coating adhesion at higher coating thicknesses.
Spacecraft Thermal Control Material Qualification Trials
Used in spacecraft thermal control material qualification trials, where the disk format suits sample-scale qualification testing and the improved atomic oxygen protection of the 50–80 nm coating is evaluated against thinner alternatives.
EMI Shielding Effectiveness Characterization
Employed in EMI shielding effectiveness characterization, where improved shielding performance over 30 nm variants allows the coating thickness effect on electromagnetic attenuation to be quantified in a controlled disk-format test specimen.

Material Properties

Chemical Resistance
Element Value
Acids - concentrated Poor
Acids - dilute Fair
Alcohols Poor
Alkalis Poor
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Halogens Fair
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.42
Hardness - Rockwell E52-99
Elongation at break( % ) Aug-70
Tensile modulus( GPa ) 2.0 – 3.0
Izod impact strength( J m⁻¹ ) 80
Tensile strength( MPa ) 70-150
Electrical Properties
Element Value
Dielectric constant @1MHz 3.4
Dissipation factor @ 1kHz 0.0018
Dielectric strength( kV mm⁻¹ ) 154 – 303
Surface resistivity( Ohm/sq ) 10¹⁶
Volume resistivity( Ohmcm ) 10¹⁸
Physical Properties
Element Value
Flammability V0
Radiation resistance Good
Refractive index 1.66
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 53
Water absorption - over 24 hours( % ) 0.2-2.9
Density( gcm⁻³ ) 1.42
Thermal Properties
Element Value
Heat-deflection temperature - 1.8MPa( C ) 360
Lower working temperature( C ) -270
Upper working temperature( C ) 250-320
Specific heat( J K⁻¹ kg⁻¹ ) 1090
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 30-60
each

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Available Configurations

Properties common to all products in this list

Composition: PI Form: Metallised Film Material: Polyimide (PI) CAS Number: 60842-76-4 Commodity: Polymers Metallized With: Aluminum - 50-80 nm Thickness: 0.025mm Surface Finish: Metallized On One Side

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