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Formula: PI
Form: Metallized Film
Material: Polyimide (PI)
CAS Number: 60842-76-4
Commodity: Polymers
Metallized With:
Aluminum - 50-80 nm
Thickness:
0.025mm
Coil Width:
300mm
Surface Finish:
Metallized On One Side
PI Coil Metallized with Aluminum, also referred to as polyimide metallized coil, is a high-performance material that incorporates an ultra-thin aluminum layer to deliver superb reflectivity and conductivity while retaining both mechanical strength and flexibility. It is particularly well-suited for use in industries such as aerospace, automotive, and telecommunications, where it functions as an electromagnetic shield and reflective surface in LED lighting applications. The polyimide support ensures excellent thermal stability and chemical resistance, making the film effective even in harsh environments. In addition, its lightweight and durable nature makes it a top choice for advanced electronic devices and components. Supplied by Goodfellow, this material conforms to the rigorous standards of high-tech industries. The distinct blend of attributes offered by PI Film Metallized with Aluminum establishes it as a versatile solution for a range of demanding applications, with Goodfellow’s quality assurance reinforcing its reliability and performance.
Tolerances
Metallized Film
| Thickness | ±10% |
|---|
Coil
| Length | +10% / -0% |
|---|
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Poor |
| Acids - dilute | Fair |
| Alcohols | Poor |
| Alkalis | Poor |
| Aromatic hydrocarbons | Good |
| Greases and Oils | Good |
| Halogenated Hydrocarbons | Good |
| Halogens | Fair |
| Ketones | Good |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.42 |
| Hardness - Rockwell | E52-99 |
| Elongation at break( % ) | Aug-70 |
| Tensile modulus( GPa ) | 02-Mar |
| Izod impact strength( J m⁻¹ ) | 80 |
| Tensile strength( MPa ) | 70-150 |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 3.4 |
| Dissipation factor @ 1kHz | 0.0018 |
| Dielectric strength( kV mm⁻¹ ) | 22 |
| Surface resistivity( Ohm/sq ) | 10¹⁶ |
| Volume resistivity( Ohmcm ) | 10¹⁸ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | V0 |
| Radiation resistance | Good |
| Refractive index | 1.66 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 53 |
| Water absorption - over 24 hours( % ) | 0.2-2.9 |
| Density( gcm⁻³ ) | 1.42 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 1.8MPa( C ) | 360 |
| Lower working temperature( C ) | -270 |
| Upper working temperature( C ) | 250-320 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1090 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.35@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 30-60 |
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Vespel® SP1 PI Film Grade: Vespel® SP1
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VICTREX® APTIV® 1102 20% mineral filled PEEK Film Grade: VICTREX® APTIV® 1102
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