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Formula: PEN
Form: Rod
Material: Polyethylene naphthalate (PEN)
CAS Number: 24968-11-4
Commodity: Polymers
PEN Rod combines high tensile strength, rigidity, and environmental resistance in a machinable cylindrical form, enabling the creation of precision components for harsh environments. With superior barrier properties and thermal stability, it serves demanding sectors such as aerospace, marine, and industrial manufacturing. Industries use PEN rods for mechanical spacers in electronics, corrosion-resistant pump components, and structural supports in chemical processing systems. Specific applications include dimensionally stable fixtures for optical systems, wear-resistant components in marine hardware, and chemical-resistant shafts in analytical equipment. In research, PEN rods are employed to evaluate polymer mechanical behavior under load, study long-term creep resistance, and prototype precision-engineered parts. The combination of structural integrity, barrier performance, and machinability ensures their value in advanced technical and scientific applications.
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Tolerances

Rod
Diameter +20% / -10%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Good-Poor
Acids - dilute Good
Alcohols Good
Alkalis Good
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.27- biax film
Elongation at break( % ) 60- biax film
Tensile modulus( GPa ) 5-5.5- biax film
Tensile strength( MPa ) 200- biax film
Electrical Properties
Element Value
Dielectric constant @1MHz 3.2@10KHz
Dissipation factor @ 1kHz 0.005
Dissipation factor @ 1MHz 0.0048@10KHz
Dielectric strength( kV mm⁻¹ ) 160@0.075mm
Surface resistivity( Ohm/sq ) 10¹⁴
Volume resistivity( Ohmcm ) 10¹⁵
Physical Properties
Element Value
Flammability VTM-2 - UL94, 0.075mm
Resistance to Ultra-violet Fair
Optical transmission( % ) 84@0.075mm
Water absorption( % ) 0.4
Density( gcm⁻³ ) 1.36
Thermal Properties
Element Value
Upper working temperature( C ) 155
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.15@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 20-21- biax film

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