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Formula: PEN
Form: Coil
Material: Polyethylene naphthalate (PEN)
CAS Number: 24968-11-4
Commodity: Polymers
Structure: Biaxially Oriented
Transparency: Transparent
PEN Coil provides continuous lengths of polyethylene naphthalate film, offering high tensile strength, excellent dimensional stability, and superior barrier properties against gases and moisture. This combination makes it ideal for high-volume manufacturing in electronics, packaging, and photovoltaic applications where long rolls streamline processing. Industries employ PEN coil for flexible printed circuits, capacitor dielectrics, and solar cell back sheets. Specific applications include roll-to-roll production of electronic interconnects, protective barrier layers in organic solar modules, and moisture-resistant laminates for advanced packaging. In research, PEN coil supports large-scale fabrication trials, testing of polymer barrier properties under extreme environmental cycling, and prototyping of flexible optoelectronic devices. Its continuous form factor combined with PEN’s inherent thermal and mechanical resilience ensures dependable performance in demanding engineering and scientific workflows.
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Tolerances

Coil
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Good-Poor
Acids - dilute Good
Alcohols Good
Alkalis Good
Aromatic hydrocarbons Good
Greases and Oils Good
Halogenated Hydrocarbons Good
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.27- biax film
Elongation at break( % ) 60- biax film
Tensile modulus( GPa ) 5-5.5- biax film
Tensile strength( MPa ) 200- biax film
Electrical Properties
Element Value
Dielectric constant @1MHz 3.2@10KHz
Dissipation factor @ 1kHz 0.005
Dissipation factor @ 1MHz 0.0048@10KHz
Dielectric strength( kV mm⁻¹ ) 160@0.075mm
Surface resistivity( Ohm/sq ) 10¹⁴
Volume resistivity( Ohmcm ) 10¹⁵
Physical Properties
Element Value
Flammability VTM-2 - UL94, 0.075mm
Resistance to Ultra-violet Fair
Optical transmission( % ) 84@0.075mm
Water absorption( % ) 0.4
Density( gcm⁻³ ) 1.36
Thermal Properties
Element Value
Upper working temperature( C ) 155
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.15@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 20-21- biax film

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