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Composition: Ni
Form: Thin Film
Material: Nickel
CAS Number: 7440-02-0
Commodity: Metals
Nickel Thin Film Disk is a precision-fabricated substrate with a uniform nickel coating or structure optimized for controlled thickness, smoothness, and functional performance. These discs combine excellent corrosion resistance, electrical conductivity, and magnetic properties, making them valuable for data storage, optical devices, and catalysis. Industries including electronics, information technology, and renewable energy use nickel thin film discs in magnetic recording media, optical recording layers, and catalytic reaction platforms. Key applications include high-density magnetic storage platters, DVD-R recording layers with optimized optical response, and electrode disks for electrochemical devices. In research, nickel thin film disks enable investigation into thin-film growth dynamics, magnetic domain behavior, and optical-material interactions. Their reproducible surface quality and functional versatility make them critical in both applied technology and fundamental science.
Health hazard/Hazardous to the ozone layer
Serious health hazard
Tolerances
Thin Film
| Thickness | ±30% |
|---|
Disk
| Diameter | ±20% |
|---|
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 28 |
| Crystal structure | Face centred cubic |
| Electronic structure | Ar 3d⁸ 4s² |
| Valences shown | 0, 1, 2, 3 |
| Atomic weight( amu ) | 58.69 |
| Thermal neutron absorption cross-section( Barns ) | 4.54 |
| Photo-electric work function( eV ) | 4.9 |
| Natural isotope distribution( Mass No./% ) | 60/ 26.10 |
| Natural isotope distribution( Mass No./% ) | 62/ 3.59 |
| Natural isotope distribution( Mass No./% ) | 61/ 1.13 |
| Natural isotope distribution( Mass No./% ) | 58/ 68.27 |
| Natural isotope distribution( Mass No./% ) | 64/ 0.91 |
| Atomic radius - Goldschmidt( nm ) | 0.125 |
| Ionisation potential( No./eV ) | 2/ 18.2 |
| Ionisation potential( No./eV ) | 4/ 54.9 |
| Ionisation potential( No./eV ) | 6/ 108 |
| Ionisation potential( No./eV ) | 1/ 7.63 |
| Ionisation potential( No./eV ) | 3/ 35.2 |
| Ionisation potential( No./eV ) | 5/ 75.5 |
Mechanical Properties
| Element | Value |
|---|---|
| Hardness - Brinell | 190 |
| Hardness - Brinell | 100 |
| Material condition | Hard |
| Material condition | Soft |
| Poisson's ratio | 0.312 |
| Poisson's ratio | 0.312 |
| Bulk modulus( GPa ) | 177.3 |
| Bulk modulus( GPa ) | 177.3 |
| Tensile modulus( GPa ) | 199.5 |
| Tensile modulus( GPa ) | 199.5 |
| Izod toughness( J m⁻¹ ) | 160 |
| Izod toughness( J m⁻¹ ) | 160 |
| Tensile strength( MPa ) | 400 |
| Tensile strength( MPa ) | 660 |
| Yield strength( MPa ) | 150 |
| Yield strength( MPa ) | 480 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 6.9@20@20°C |
| Temperature coefficient( K⁻¹ ) | 0.0068@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | -1.48 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 2732 |
| Density( gcm⁻³ ) | 8.9@20 |
| Density( gcm⁻³ ) | 8.9@20C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 1453 |
| Latent heat of evaporation( J g⁻¹ ) | 6378 |
| Latent heat of fusion( J g⁻¹ ) | 292 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 444@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 90.9@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 13.3@0-100°C |
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