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Nickel Sputtering Target

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Composition: Ni Form: Sputtering Target Material: Nickel CAS Number: 7440-02-0 Commodity: Metals Purity: 99.99%
Nickel Sputtering Target is a high-purity metallic source material engineered for thin-film deposition via physical vapor deposition (PVD) techniques such as magnetron sputtering. It offers excellent thermal and electrical conductivity, uniform grain structure, and high sputter yield, ensuring consistent deposition rates and film quality. Industries including microelectronics, magnetic storage, and optoelectronics employ nickel sputtering targets to fabricate conductive interconnects, magnetic layers, and barrier coatings. Specific applications include thin-film magnetic recording media, diffusion barrier layers in semiconductor devices, and seed layers for multilayer structures. In research, nickel sputtering targets enable precise control over film stoichiometry, morphology, and magnetic properties, advancing the development of high-performance electronic and magnetic components. Their reliability and reproducibility make them indispensable in both prototyping and high-volume manufacturing.

Health hazard/Hazardous to the ozone layer

Serious health hazard

Starting at $238.00 each
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Material Properties

Atomic Properties
Element Value
Atomic number 28
Crystal structure Face centred cubic
Electronic structure Ar 3d⁸ 4s²
Valences shown 0, 1, 2, 3
Atomic weight( amu ) 58.69
Thermal neutron absorption cross-section( Barns ) 4.54
Photo-electric work function( eV ) 4.9
Natural isotope distribution( Mass No./% ) 60/ 26.10
Natural isotope distribution( Mass No./% ) 62/ 3.59
Natural isotope distribution( Mass No./% ) 61/ 1.13
Natural isotope distribution( Mass No./% ) 58/ 68.27
Natural isotope distribution( Mass No./% ) 64/ 0.91
Atomic radius - Goldschmidt( nm ) 0.125
Ionisation potential( No./eV ) 2/ 18.2
Ionisation potential( No./eV ) 4/ 54.9
Ionisation potential( No./eV ) 6/ 108
Ionisation potential( No./eV ) 1/ 7.63
Ionisation potential( No./eV ) 3/ 35.2
Ionisation potential( No./eV ) 5/ 75.5
Mechanical Properties
Element Value
Hardness - Brinell 190
Hardness - Brinell 100
Material condition Hard
Material condition Soft
Poisson's ratio 0.312
Poisson's ratio 0.312
Bulk modulus( GPa ) 177.3
Bulk modulus( GPa ) 177.3
Tensile modulus( GPa ) 199.5
Tensile modulus( GPa ) 199.5
Izod toughness( J m⁻¹ ) 160
Izod toughness( J m⁻¹ ) 160
Tensile strength( MPa ) 400
Tensile strength( MPa ) 660
Yield strength( MPa ) 150
Yield strength( MPa ) 480
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 6.9@20°C
Temperature coefficient( K⁻¹ ) 0.0068@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) -1.48
Physical Properties
Element Value
Boiling point( C ) 2732
Density( gcm⁻³ ) 8.9@20
Density( gcm⁻³ ) 8.9@20C
Thermal Properties
Element Value
Melting point( C ) 1453
Latent heat of evaporation( J g⁻¹ ) 6378
Latent heat of fusion( J g⁻¹ ) 292
Specific heat( J K⁻¹ kg⁻¹ ) 444@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 90.9@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 13.3@0-100°C
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Available Configurations

Properties common to all products in this list

Composition: Ni Form: Sputtering Target Material: Nickel CAS Number: 7440-02-0 Commodity: Metals Purity: 99.99%

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