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Formula: Mo
Form: Thin Film
Material: Molybdenum
CAS Number: 7439-98-7
Commodity: Metals
Purity:
99.9%
Support:
Permanent Mylar® 3.5µm
Molybdenum Thin Film Disk combines high conductivity, excellent adhesion, and superior thermal stability in a circular form coated with a uniform thin molybdenum layer. The thin film enhances performance in electronics, optics, and catalysis by providing controlled surface properties without compromising bulk stability. Industries employ molybdenum thin film disks in microelectronic fabrication, sensor development, and high-performance optical coatings. Specific applications include electrode layers in thin-film transistors, reflective layers in advanced optics, and catalytic surfaces for energy conversion devices. Research explores thin-film molybdenum in nanostructured devices, electron transport studies, and multilayer heterostructures for next-generation electronics. The disk format ensures uniform surface geometry, reproducibility, and easy integration into precision devices, reinforcing its role as a versatile platform for both applied technologies and fundamental thin-film research.
Tolerances
Thin Film
| Thickness | ±30% |
|---|
Disk
| Diameter | ±20% |
|---|
Material Properties for Metals
Atomic Properties
| Element | Value |
|---|---|
| Atomic number | 42 |
| Crystal structure | Body centred cubic |
| Electronic structure | Kr 4d⁵ 5s¹ |
| Valences shown | 2, 3, 4, 5, 6 |
| Atomic weight( amu ) | 95.94 |
| Thermal neutron absorption cross-section( Barns ) | 2.65 |
| Photo-electric work function( eV ) | 4.2 |
| Natural isotope distribution( Mass No./% ) | 95/ 15.9 |
| Natural isotope distribution( Mass No./% ) | 96/ 16.7 |
| Natural isotope distribution( Mass No./% ) | 98/ 24.1 |
| Natural isotope distribution( Mass No./% ) | 97/ 9.6 |
| Natural isotope distribution( Mass No./% ) | 92/ 14.8 |
| Natural isotope distribution( Mass No./% ) | 94/ 9.3 |
| Natural isotope distribution( Mass No./% ) | 100/ 9.6 |
| Atomic radius - Goldschmidt( nm ) | 0.14 |
| Ionisation potential( No./eV ) | 2/ 16.15 |
| Ionisation potential( No./eV ) | 5/ 61.2 |
| Ionisation potential( No./eV ) | 68 |
| Ionisation potential( No./eV ) | 1/ 7.10 |
| Ionisation potential( No./eV ) | 3/ 27.2 |
| Ionisation potential( No./eV ) | 4/ 46.4 |
Mechanical Properties
| Element | Value |
|---|---|
| Material condition | Hard |
| Material condition | Soft |
| Poisson's ratio | 0.293 |
| Poisson's ratio | 0.293 |
| Bulk modulus( GPa ) | 261.2 |
| Bulk modulus( GPa ) | 261.2 |
| Tensile modulus( GPa ) | 324.8 |
| Tensile modulus( GPa ) | 324.8 |
| Hardness - Vickers( kgf mm⁻² ) | 250 |
| Hardness - Vickers( kgf mm⁻² ) | 200 |
| Tensile strength( MPa ) | 485-550 |
| Tensile strength( MPa ) | 620-690 |
| Yield strength( MPa ) | 550 |
| Yield strength( MPa ) | 415-450 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 5.7@20@20°C |
| Superconductivity critical temperature( K ) | 0.915 |
| Temperature coefficient( K⁻¹ ) | 0.00435@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 1.45 |
Physical Properties
| Element | Value |
|---|---|
| Boiling point( C ) | 4612 |
| Density( gcm⁻³ ) | 10.22@20°C |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 2617 |
| Latent heat of evaporation( J g⁻¹ ) | 6153 |
| Latent heat of fusion( J g⁻¹ ) | 290 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 251@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 138@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 5.1@0-100°C |
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