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Technical Data Sheet
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130°C Heat Sealable Polypropylene Disk

130°C Heat Sealable Polypropylene Disk offers a controlled seal initiation temperature, enabling reliable thermal bonding in packaging, sealing, and lamination processes. Produced from polypropylene copolymers or multilayer structures, it provides a combination of excellent water vapor barrier properties, good mechanical strength, and chemical resistance. These disks are widely used in food packaging, medical device sealing, and laboratory sample containment, where consistent and secure closure integrity is critical. Specific applications include heat-sealed container lids in sterile packaging, tamper-evident seals for pharmaceuticals, and protective closures in chemical reagent storage. In research and manufacturing, they facilitate advancements in controlled atmosphere packaging and micro-environment sealing, enhancing both product safety and shelf life. Their ability to deliver consistent sealing performance at moderate temperatures while retaining durability positions them as an essential material in both scientific development and industrial-scale production.
Grade: Heat Sealable - Minimum 130°C
Formula: PP
Thickness: 0.03mm
Diameter: 6mm
Structure: Biaxially Oriented
Transparency: Clear/Transparent
CAS Number: 9003-07-0
UOM Code: 205-435-83
Legacy Code: PP301300
Distributor Code:
GF20543583
SKU: 1000083083
Product Code: PP30-FM-000200

Tolerances

Disk
Thickness ±20%

Tolerances

Disk
Thickness ±20%
Technical Data Sheet
Safety Data Sheet
$148.00
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Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Good-Fair
Acids - dilute Good-Fair
Alcohols Good
Alkalis Good
Aromatic hydrocarbons Fair
Greases and Oils Good-Fair
Halogenated Hydrocarbons Good-Poor
Halogens Poor
Ketones Good
Mechanical Properties
Element Value
Coefficient of friction 0.1-0.3
Hardness - Rockwell R80-100
Elongation at break( % ) 150-300, for biax film >50
Tensile modulus( GPa ) 0.9-1.5, for biax film 2.2-4.2
Izod impact strength( J m⁻¹ ) 20-100
Abrasive resistance - ASTM D1044( mg/1000 cycles ) 13-16
Tensile strength( MPa ) 25-40, for biax film 130-300,
Electrical Properties
Element Value
Dielectric constant @1MHz 2.2-2.6
Dissipation factor @ 1MHz 0.0003-0.0005
Dielectric strength( kV mm⁻¹ ) 30-40
Surface resistivity( Ohm/sq ) 10¹³
Volume resistivity( Ohmcm ) 10¹⁶-10¹⁸
Physical Properties
Element Value
Flammability HB
Radiation resistance Fair
Refractive index 1.49
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 18
Water absorption - equilibrium( % ) 0.03
Density( gcm⁻³ ) 0.9
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 100-105
Heat-deflection temperature - 1.8MPa( C ) 60-65
Lower working temperature( C ) 50
Upper working temperature( C ) 90-120
Specific heat( J K⁻¹ kg⁻¹ ) 1700-1900
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.1-0.22@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 100-180
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