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Grade: Heat Sealable - Minimum 130°C
Formula: PP
Form: Coil
Material: Polypropylene (PP)
CAS Number: 9003-07-0
Commodity: Polymers
Structure:
Biaxially Oriented
Transparency:
Clear/Transparent
The Heat Sealable - Minimum 130°C PP Coil is a polypropylene film product available in 24 sizes. This thin and flexible film offers properties like heat sealability above 130°C and chemical inertness. Its applications include food packaging where heat sealing allows hermetic seals, and label stock where printability and flexibility are desirable. Our wide range of sizes makes this a versatile product the ideal choice for prototyping and production across both industrial and scientific settings.
Tolerances
Coil
| Thickness | ±20% |
|---|
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Good-Fair |
| Acids - dilute | Good-Fair |
| Alcohols | Good |
| Alkalis | Good |
| Aromatic hydrocarbons | Fair |
| Greases and Oils | Good-Fair |
| Halogenated Hydrocarbons | Good-Poor |
| Halogens | Poor |
| Ketones | Good |
Mechanical Properties
| Element | Value |
|---|---|
| Coefficient of friction | 0.1-0.3 |
| Hardness - Rockwell | R80-100 |
| Elongation at break( % ) | 150-300, for biax film >50 |
| Tensile modulus( GPa ) | 0.9-1.5, for biax film 2.2-4.2 |
| Izod impact strength( J m⁻¹ ) | 20-100 |
| Abrasive resistance - ASTM D1044( mg/1000 cycles ) | 13-16 |
| Tensile strength( MPa ) | 25-40, for biax film 130-300, |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 2.2-2.6 |
| Dissipation factor @ 1MHz | 0.0003-0.0005 |
| Dielectric strength( kV mm⁻¹ ) | 30-40 |
| Surface resistivity( Ohm/sq ) | 10¹³ |
| Volume resistivity( Ohmcm ) | 10¹⁶-10¹⁸ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | HB |
| Radiation resistance | Fair |
| Refractive index | 1.49 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 18 |
| Water absorption - equilibrium( % ) | 0.03 |
| Density( gcm⁻³ ) | 0.9 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 0.45MPa( C ) | 100-105 |
| Heat-deflection temperature - 1.8MPa( C ) | 60-65 |
| Lower working temperature( C ) | 50 |
| Upper working temperature( C ) | 90-120 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 1700-1900 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.1-0.22@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 100-180 |
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