Gold Thin Film (Mylar®/Quartz Backing)

Gold Thin Film combines the unparalleled electrical conductivity, chemical inertness, and optical reflectivity of gold with the precision control of thin-film deposition. These films, often created via sputtering or evaporation, offer uniform thickness and surface smoothness essential for microelectronics, photonics, and sensing technologies. They are widely employed in semiconductor interconnect layers, reflective optical coatings, and biocompatible electrode surfaces. Key applications include plasmonic devices, high-performance photodetectors, and corrosion-resistant microcircuit contacts. Technologies benefiting from gold thin films include narrow-band perfect absorbers for photonic filtering, reusable chlorine sensors in water treatment, and high-reflectivity mirrors in laser systems. With tunable thickness influencing crystalline structure, surface morphology, and optical behavior, these films are critical in research on light–matter interactions, quantum devices, and flexible electronics. Gold Thin Film remains an indispensable platform material where reproducibility, purity, and performance define success in both scientific discovery and industrial application.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Thin Film

Thickness		±30%

Sizes

Linear dimension		±20%

Material Properties for Precious Metals

Atomic Properties

Element	Value
Atomic number	79
Crystal structure	Face centred cubic
Electronic structure	Xe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown	1,3
Atomic weight( amu )	196.9665
Thermal neutron absorption cross-section( Barns )	98.8
Photo-electric work function( eV )	4.8
Atomic radius - Goldschmidt( nm )	0.144
Ionisation potential( No./eV )	1/ 9.22
Ionisation potential( No./eV )	2/ 20.5

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.42
Poisson's ratio	0.42
Bulk modulus( GPa )	171
Bulk modulus( GPa )	171
Tensile modulus( GPa )	78.5
Tensile modulus( GPa )	78.5
Hardness - Vickers( kgf mm⁻² )	20-30
Hardness - Vickers( kgf mm⁻² )	60
Tensile strength( MPa )	130
Tensile strength( MPa )	220
Yield strength( MPa )	205
Yield strength( MPa )	-

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	2.20@20@20°C
Temperature coefficient( K⁻¹ )	0.004@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.74

Physical Properties

Element	Value
Boiling point( C )	3080
Density( gcm⁻³ )	19.3@20°C

Thermal Properties

Element	Value
Melting point( C )	1064.4
Latent heat of evaporation( J g⁻¹ )	1738
Latent heat of fusion( J g⁻¹ )	64.9
Specific heat( J K⁻¹ kg⁻¹ )	129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	14.1@0-100°C