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Gold Rod

Available Configurations

Properties common to all products in this list

Composition: Au Form: Rod Material: Gold CAS Number: 7440-57-5 Commodity: Precious Metals Purity: 99.95% (3N5) Temper: As Drawn
Diameter Length
1.6 mm to 10 mm 4 mm to 1000 mm

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Gold Rod is available in purities from 99.9% (3N) to 99.98% (3N8) in hard and as-drawn tempers, combining the noble metal's absolute chemical inertness, high density, and excellent electrical conductivity with the mechanical strength of work-hardened rod stock in a directly machinable format. Unlike annealed gold, the hard and as-drawn tempers provide substantially greater tensile strength and resistance to deformation under mechanical load — critical for precision machined electrical contact pins, connector components, and instrumentation parts where soft gold would deform during assembly or in service. Its density of 19.32 g/cm³, melting point of 1064 °C, and face-centred cubic structure support reliable performance across the temperature range encountered in electronics assembly and precision instrumentation. Gold's resistance to oxidation and surface tarnish under all conditions of service ensures consistent contact resistance throughout the component lifetime — the defining property that makes gold the reference material for high-reliability electrical contacts in aerospace, defence, and precision instrumentation connectors. Electrochemical applications exploit its chemical inertness as a stable, reproducible working or reference electrode material in corrosive or biologically active media. The 3N to 3N8 purity range suits demanding industrial and analytical applications; higher-purity grades are available where trace metallic contamination would compromise electrochemical measurements or surface chemistry studies. In research, gold rod is machined into electrode blanks, spectroscopic substrates, and SERS substrates, and serves as feedstock for high-purity gold film deposition and nanoparticle synthesis.
Starting at $820.00 each
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Key Features

Gold Rod is available in purities from 99.9% (3N) to 99.98% (3N8) in hard and as-drawn tempers, combining noble metal inertness with work-hardened mechanical strength in a directly machinable format:

Hard and As-Drawn Tempers

Provide substantially greater tensile strength and resistance to deformation than annealed gold. Critical for precision machined electrical contact pins and connector components where soft gold would deform during assembly or in service.

Absolute Chemical Inertness

Gold resists oxidation and surface tarnish under all conditions of service, ensuring consistent contact resistance throughout the component lifetime. This is the defining property for high-reliability electrical contacts in aerospace, defense, and precision instrumentation.

Density 19.32 g/cm³, Melting Point 1,064 °C

Support reliable performance across the temperature range of electronics assembly and precision instrumentation, and provide the density needed for counterweight and ballast components.

Face-Centered Cubic Structure

Provides the machinability needed for complex electrode, contact, and spectroscopic substrate geometries.

Electrochemical Stability

A stable, reproducible working or reference electrode material in corrosive or biologically active media, where less noble metals would corrode or introduce surface chemistry artifacts into measurements.

Purity Range 3N to 3N8

Suits demanding industrial and analytical applications. Higher-purity grades are available where trace metallic contamination would compromise electrochemical measurements or surface chemistry studies.

Industrial Applications

Gold Rod is used across high-reliability electrical contacts, electrochemistry, spectroscopy, and materials research wherever absolute chemical inertness and work-hardened mechanical strength must be combined:

High-Reliability Electrical Contact Pins and Connectors
Machined into contact pins and connector components for aerospace, defense, and precision instrumentation where the hard or as-drawn temper resists deformation under assembly and service loads and the tarnish-free surface ensures consistent, long-term contact resistance.
Electrochemical Electrode Blanks
Machined into working and reference electrode blanks for research in corrosive and biologically active media, where gold’s inertness provides a stable electrode surface free from artifacts introduced by less noble materials.
SERS Substrates and Spectroscopic Components
Used as stock for machining SERS substrates and spectroscopic components where the noble metal surface supports plasmon-enhanced spectroscopy.
PVD Feedstock for High-Purity Gold Films
Applied as feedstock for gold film deposition by evaporation or sputtering, where purity controls trace metallic contamination in deposited films for electronics and research applications.
Nanoparticle Synthesis and Surface Chemistry Research
Source material for gold nanoparticle synthesis and surface chemistry studies where purity and chemical inertness control nanoparticle composition and experimental reproducibility.

Material Properties

Atomic Properties
Element Value
Atomic number 79
Crystal structure Face centred cubic
Electronic structure Xe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown 1,3
Atomic weight( amu ) 196.9665
Thermal neutron absorption cross-section( Barns ) 98.8
Photo-electric work function( eV ) 4.8
Atomic radius - Goldschmidt( nm ) 0.144
Ionisation potential( No./eV ) 1/ 9.22
Ionisation potential( No./eV ) 2/ 20.5
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.42
Poisson's ratio 0.42
Bulk modulus( GPa ) 171
Bulk modulus( GPa ) 171
Tensile modulus( GPa ) 78.5
Tensile modulus( GPa ) 78.5
Hardness - Vickers( kgf mm⁻² ) 20-30
Hardness - Vickers( kgf mm⁻² ) 60
Tensile strength( MPa ) 130
Tensile strength( MPa ) 220
Yield strength( MPa ) 205
Yield strength( MPa ) -
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 2.20@20°C
Temperature coefficient( K⁻¹ ) 0.004@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.74
Physical Properties
Element Value
Boiling point( C ) 3080
Density( gcm⁻³ ) 19.3@20°C
Thermal Properties
Element Value
Melting point( C ) 1064.4
Latent heat of evaporation( J g⁻¹ ) 1738
Latent heat of fusion( J g⁻¹ ) 64.9
Specific heat( J K⁻¹ kg⁻¹ ) 129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 14.1@0-100°C
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Available Configurations

Properties common to all products in this list

Composition: Au Form: Rod Material: Gold CAS Number: 7440-57-5 Commodity: Precious Metals Purity: 99.95% (3N5) Temper: As Drawn

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Tolerances

Rod
Diameter =<10mm ±10%
Diameter >10mm ±5%
Length <100mm ±1mm
Length >=100mm +5 / -1%