Gold Balls

Gold Balls are precisely formed metallic spheres characterized by exceptional chemical stability, electrical conductivity, and malleability. Produced through controlled melting and surface tension-driven spheroidization, these nearly perfect spheres ensure uniformity critical for high-reliability interconnects. They are foundational in microelectronics, semiconductor bonding, and precision instrumentation, where gold’s inertness and excellent conductivity are essential. Gold balls are widely applied in flip-chip bonding, micro-optomechanical systems (MOEMS), and MEMS devices requiring conductive, corrosion-resistant interfaces. In particular, they enable secure electrical joins in ultrasonic and thermosonic wire bonding, offering performance in high-frequency and high-temperature environments. Their use has expanded into advanced packaging technologies, quantum dot anchoring, and fine-pitch bonding in photonic and biomedical devices. Gold Balls are a vital material in scientific and industrial R&D due to their role in miniaturized systems, durable interconnects, and reproducible conductive bonding—a core component in next-generation electronics and precision assembly techniques.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Ball/Sphere

Diameter	Standard	±5%
Diameter	Precision	See Item

Material Properties for Precious Metals

Atomic Properties

Element	Value
Atomic number	79
Crystal structure	Face centred cubic
Electronic structure	Xe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown	1,3
Atomic weight( amu )	196.9665
Thermal neutron absorption cross-section( Barns )	98.8
Photo-electric work function( eV )	4.8
Atomic radius - Goldschmidt( nm )	0.144
Ionisation potential( No./eV )	1/ 9.22
Ionisation potential( No./eV )	2/ 20.5

Mechanical Properties

Element	Value
Material condition	Soft
Material condition	Hard
Poisson's ratio	0.42
Poisson's ratio	0.42
Bulk modulus( GPa )	171
Bulk modulus( GPa )	171
Tensile modulus( GPa )	78.5
Tensile modulus( GPa )	78.5
Hardness - Vickers( kgf mm⁻² )	20-30
Hardness - Vickers( kgf mm⁻² )	60
Tensile strength( MPa )	130
Tensile strength( MPa )	220
Yield strength( MPa )	205
Yield strength( MPa )	-

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	2.20@20@20°C
Temperature coefficient( K⁻¹ )	0.004@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV )	0.74

Physical Properties

Element	Value
Boiling point( C )	3080
Density( gcm⁻³ )	19.3@20°C

Thermal Properties

Element	Value
Melting point( C )	1064.4
Latent heat of evaporation( J g⁻¹ )	1738
Latent heat of fusion( J g⁻¹ )	64.9
Specific heat( J K⁻¹ kg⁻¹ )	129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ )	318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	14.1@0-100°C