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Quartz - Fused Sputtering Target

Formula: SiO₂
Form: Sputtering Target
Material: Quartz - Fused
CAS Number: 14808-60-7
Commodity: Ceramics
Our range of Quartz - Fused Sputtering Targets are manufactured from high purity fused quartz and are available in a variety of dimensions and thicknesses. They have excellent chemical and physical stability at high temperatures making them ideal for sputtering applications where high purity and uniformity is required. They’re commonly used in microelectronics and semiconductor device fabrication to deposit thin and uniform quartz layers onto silicon wafers and other substrates. With 10 variations to choose from, we can provide fused quartz sputtering target disks tailored to your specific sputtering needs.
Technical Data Sheet Safety Data Sheet Tolerance Properties
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Material Properties for Ceramics

Chemical Resistance
Element Value
Acids - concentrated Good
Acids - dilute Good
Alkalis Fair
Halogens Good
Metals Fair
Electrical Properties
Element Value
Dielectric constant 3.8
Dielectric strength( kV mm⁻¹ ) 25-40
Volume resistivity( Ohmcm ) 10¹⁸@25
Physical Properties
Element Value
Refractive index 1.46
Useful optical transmission range 180-2500nm
Apparent porosity( % ) 0
Water absorption - saturation( % ) 0
Density( gcm⁻³ ) 2.2
Thermal Properties
Element Value
Melting point( C ) 1715
Upper continuous use temperature( C ) 1100-1400
Specific heat( J K⁻¹ kg⁻¹ ) 670-740@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 1.46@20°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 0.54@20-1000
Mechanical Properties
Element Value
Tensile modulus( GPa ) 72-74
Hardness - Knoop( kgf mm⁻² ) 820
Hardness - Vickers( kgf mm⁻² ) 1000
Shear strength( MPa ) 70
Tensile strength( MPa ) 48
Pultrusions
Element Value
Compressive strength( MPa ) 1100

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