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Formula: Cu 70/Ag 30
Form: Rod
Material: Copper/Silver
Commodity: Alloys
Diameter: 15mm
Temper: As Drawn

Copper/Silver Alloy Rod (Cu70/Ag30)

Copper/Silver Alloy Rod (Cu70/Ag30) combines copper’s high electrical and thermal conductivity with silver’s superior oxidation resistance, mechanical strength, and surface stability. The 70/30 ratio optimizes conductivity while enhancing wear resistance and corrosion protection, making it well-suited for environments requiring both electrical performance and durability. In rod form, it offers excellent machinability, uniform structure, and consistent composition, supporting precision fabrication and long-term operational stability. This alloy is widely applied in electrical engineering, high-performance contact manufacturing, and specialized mechanical components. Technologies benefiting from it include low-resistance, high-strength electrical connectors, high-frequency RF contacts, and wear-resistant current-carrying elements. In research, it enables investigations into silver–copper phase behavior, diffusion bonding, and the role of silver in enhancing conductivity and corrosion resistance. Industrially, Copper/Silver Alloy Rod (Cu70/Ag30) is valued for enabling components that maintain performance under high-load, high-temperature, and corrosive service conditions.
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Tolerances

Rod
Diameter =<10mm ±10%
Diameter >10mm ±5%

Material Properties for Alloys

Thermal Properties
Element Value
Melting point( C ) 945

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