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    :: Shapal™ Hi-M Analysis

    Comparison of Shapal™-M soft with Shapal™ Hi-M soft and traditional ceramics

    This information is provided to help existing users of Shapal™-M soft compare it with the new Shapal™ Hi-M soft material and also to help users of traditional ceramics evaluate this machineable ceramic for their application.

    Comparison of flexural strengths and thermal conductivities (Typical Data)

    Shapal comparison graph of flexural strengths and thermal conductivities

    Data Supplied by Tokuyama Corporation, Tokyo, Japan

    Impurities

    Element Shapal™-M soft Shapal™ Hi-M soft
    Element C Shapal™-M soft 300ppm Shapal™ Hi-M soft 300ppm
    Element Ca Shapal™-M soft 450ppm Shapal™ Hi-M soft 1300ppm
    Element Cr Shapal™-M soft 60ppm Shapal™ Hi-M soft 1ppm
    Element Mg Shapal™-M soft 15ppm Shapal™ Hi-M soft 1ppm
    Element Ni Shapal™-M soft <5ppm Shapal™ Hi-M soft 2ppm
    Element Fe Shapal™-M soft 20ppm Shapal™ Hi-M soft 8ppm
    Element Si Shapal™-M soft <15ppm Shapal™ Hi-M soft 40ppm
    Element O Shapal™-M soft 0.5% Shapal™ Hi-M soft 0.9%
    Element Ti Shapal™-M soft <1 Shapal™ Hi-M soft <20
    Property/Test Condition Shapal™-M soft Shapal™ Hi-M soft Units
    GENERAL
    Property/Test Condition Density Corrected to 4°C Shapal™-M soft 2.88 Shapal™ Hi-M soft 2.88 Units g/cm³
    Property/Test Condition Porosity 25°C Shapal™-M soft 0 Shapal™ Hi-M soft 0 Units %
    ELECTRICAL
    Property/Test Condition Volume Resistivity 25°C, DC Shapal™-M soft 1.4 x 1012 Shapal™ Hi-M soft 1.0 x 1015 Units Ωcm 
    Property/Test Condition Dissipation Factor (tan δ) 25°C, 1MHz Shapal™-M soft 9.1 x 10-4 Shapal™ Hi-M soft 10 x 10-4 Units  
    Property/Test Condition Dielectric Constant (ε) 25°C, 1MHz Shapal™-M soft 6.9 Shapal™ Hi-M soft 6.8 Units  
    Property/Test Condition Dielectric Strength Shapal™-M soft 56 Shapal™ Hi-M soft 65 Units kV/mm
    THERMAL
    Property/Test Condition Thermal Expansion Coefficient RT~400°C Shapal™-M soft 4.4 x 10-6 Shapal™ Hi-M soft 4.8 x 10-6 Units /°C
    Property/Test Condition Thermal Expansion Coefficient RT~600°C Shapal™-M soft 4.8 x 10-6 Shapal™ Hi-M soft 4.9 x 10-6 Units /°C
    Property/Test Condition Thermal Expansion Coefficient RT~800°C Shapal™-M soft 5.1 x 10-6 Shapal™ Hi-M soft 5.0 x 10-6 Units /°C
    Property/Test Condition Thermal Conductivity 25°C Shapal™-M soft 96 Shapal™ Hi-M soft 92 Units W/mK
    Property/Test Condition Maximum Use Temp. (in air) Shapal™-M soft 1,000 Shapal™ Hi-M soft 1,000 Units °C
    Property/Test Condition Maximum Use Temp (in nonoxidizing atmosphere) Shapal™-M soft 1,900 Shapal™ Hi-M soft 1,900 Units °C
    Property/Test Condition Thermal Shock Resistance ∆t water quench Shapal™-M soft 400 Shapal™ Hi-M soft 400 Units °C
    MECHANICAL
    Property/Test Condition Bending Strength 25°C Shapal™-M soft 273 Shapal™ Hi-M soft 300 Units MPa 
    Property/Test Condition Compressive Strength 25°C Shapal™-M soft 120 Shapal™ Hi-M soft 100 Units kg/mm2
    Property/Test Condition Young's Modulus 25°C Shapal™-M soft 1.9 x 104 Shapal™ Hi-M soft 1.8 x 104 Units kg/mm2
    Property/Test Condition Poisson's Ratio 25°C Shapal™-M soft 0.31 Shapal™ Hi-M soft 0.31 Units  
    Property/Test Condition Vickers Hardness (Hv) 25°C, 300g Shapal™-M soft 390 Shapal™ Hi-M soft 380 Units kg/mm2
    CHEMICAL DURABILITY
    Property/Test Condition Resistance to Acid 10%HCI 24Hrs, 25°C Shapal™-M soft 0.2 Shapal™ Hi-M soft 0.2 Units mg/cm2 wt loss
    Property/Test Condition Resistance to Base 10%NaOH 24Hrs, 25°C Shapal™-M soft 60 Shapal™ Hi-M soft 60 Units mg/cm2 wt loss

    Note:  Shapal™ is a registered trademark of Tokuyama Corporation, Tokyo, Japan