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Formula: ZrN
Form: Sputtering Target
Material: Zirconium Nitride
CAS Number: 25658-42-8
Commodity: Compounds
Thickness:
3mm
Diameter:
50.8mm
Hazard Pictogram:
GHS03
Zirconium Nitride Sputtering Targets are made from high-purity zirconium nitride. With excellent hardness, electrical conductivity and thermal stability, they enable the deposition of thin zirconium nitride films via sputtering. Zirconium nitride films are used as wear-resistant coatings, diffusion barriers in microelectronics, and decorative coatings. We offer Zirconium Nitride Sputtering Targets in a variety of sizes and thicknesses to suit different deposition processes and equipment.
Oxidising
Material Properties for Compounds
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 2980-50 |
Physical Properties
| Element | Value |
|---|---|
| Density( gcm⁻³ ) | 7.09 |
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Vanadium Nitride Powder Formula: VN
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Weight: 500g
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UOM Code: 225-313-96
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Vanadium Nitride - V3N Powder Formula: V₃N
Maximum Particle Size: 150µm
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Titanium Nitride Powder Formula: TiN
Percentage Purity: 99%
Maximum Particle Size: 45µm
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CAS Number: 25583-20-4
UOM Code: 345-789-62
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Niobium Nitride Powder Formula: NbN
Percentage Purity: 99%
Maximum Particle Size: 150µm
Weight: 200g
UOM Code: 028-955-32
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Silicon Nitride Powder Formula: Si₃N₄
Percentage Purity: 99%
Weight: 200g
Class: Nanomaterials
Structure: Amorphous
UOM Code: 130-360-70
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