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Tungsten Foil
Available Configurations
Properties common to all products in this list
| Purity | Thickness | Length | Width | Temper Options | Surface Finish Options |
|---|---|---|---|---|---|
| 99.95% | 0.003mm to 50mm | 5mm to 600mm | 5mm to 300mm | As Rolled | Polished on one side |
Need custom configurations? Please contact our Technical Solutions team.
Key Features
Tungsten foil possesses a combination of material characteristics that make it particularly well suited for aerospace, semiconductor, high-temperature processing, medical, and scientific research applications:
Extremely High Melting Point (3,422 °C)
Tungsten has the highest melting point of all metals, allowing tungsten foil to maintain structural integrity in extreme thermal environments. This makes it ideal for use in vacuum furnaces, aerospace insulation, and thermal shielding in semiconductor processing.
High Density (19.3 g/cm³)
Tungsten's high density provides excellent mass-to-volume efficiency and mechanical stability. It is especially valuable in aerospace, defence, and high-vacuum systems where compact, high-strength materials are required.
Minimal Thermal Expansion & Ultra-Low Vapor Pressure
Tungsten exhibits very low thermal expansion and the lowest vapour pressure of any metal, even at elevated temperatures. These properties ensure dimensional stability and material integrity in high-vacuum, high-temperature systems such as X-ray targets and ion implantation equipment.
Stable Electrical & Thermal Conductivity
Tungsten foil maintains reliable electrical and thermal conductivity at high temperatures. It is widely used in vacuum electronics, cathodes, and heat spreaders in power electronics and high-reliability assemblies.
Corrosion Resistance & Chemical Stability
Tungsten resists most acids and alkalis at room temperature and remains chemically inert in vacuum or inert gas environments. This ensures long-term performance in corrosive or reactive systems.
High Mechanical Strength & Wear Resistance
Tungsten foil retains excellent tensile strength and hardness, offering superior resistance to mechanical wear and deformation. It is suitable for demanding applications requiring durability and abrasion resistance.
Precision Formability & Surface Uniformity
Tungsten can be processed into ultra-thin foils with tight dimensional tolerances and smooth, uniform surfaces. These characteristics support its use in microfabrication, sputtering targets, and high-precision shielding applications.
Industrial Applications
High-purity tungsten foil is used across advanced industries for its extreme heat resistance, dimensional stability, and mechanical durability in demanding environments:
- ✦ Aerospace & Space Systems
- Employed in thermal shielding, propulsion components, and structural liners, where its high melting point and low vapour pressure ensure performance in vacuum, radiation, and high-temperature conditions.
- ✦ Electronics & Semiconductor Fabrication
- Used in thin-film deposition, sputtering targets, and heat spreaders for microelectronic devices, where its thermal conductivity and dimensional precision support high-density circuit integration.
- ✦ High-Temperature Processing Equipment
- Applied in furnace linings, sintering boats, and heat shields for vacuum and inert gas furnaces, where its strength and oxidation resistance enable long-term operation at extreme temperatures.
- ✦ Medical & Diagnostic Devices
- Utilised in radiation shielding, collimators, and precision imaging components due to its high density, biocompatibility, and ability to attenuate X-rays and gamma radiation.
- ✦ Scientific Instrumentation & Research Systems
- Used in particle accelerators, vacuum chambers, and high-energy physics experiments, where its structural stability and resistance to thermal deformation are critical under extreme mechanical and thermal loads.
Synonyms
Material Properties
| Element | Value |
|---|---|
| Atomic number | 74 |
| Crystal structure | Body centred cubic |
| Electronic structure | Xe 4f¹⁴ 5d⁴ 6s² |
| Valences shown | 2,3,4,5,6 |
| Atomic weight( amu ) | 183.85 |
| Thermal neutron absorption cross-section( Barns ) | 18.5 |
| Photo-electric work function( eV ) | 4.55 |
| Natural isotope distribution( Mass No./% ) | 183/ 14.3 |
| Natural isotope distribution( Mass No./% ) | 182/ 26.3 |
| Natural isotope distribution( Mass No./% ) | 186/ 28.6 |
| Natural isotope distribution( Mass No./% ) | 180/ 0.1 |
| Natural isotope distribution( Mass No./% ) | 184/ 30.7 |
| Atomic radius - Goldschmidt( nm ) | 0.141 |
| Ionisation potential( No./eV ) | 1/ 7.98 |
| Ionisation potential( No./eV ) | 2/ 17.7 |
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.28 |
| Poisson's ratio | 0.28 |
| Bulk modulus( GPa ) | 311 |
| Bulk modulus( GPa ) | 311 |
| Tensile modulus( GPa ) | 411 |
| Tensile modulus( GPa ) | 411 |
| Hardness - Vickers( kgf mm⁻² ) | 360 |
| Hardness - Vickers( kgf mm⁻² ) | 500 |
| Tensile strength( MPa ) | 550-620 |
| Tensile strength( MPa ) | 1920 |
| Yield strength( MPa ) | 550 |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 5.4@20°C |
| Superconductivity critical temperature( K ) | 0.0154 |
| Temperature coefficient( K⁻¹ ) | 0.0048@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 1.12 |
| Element | Value |
|---|---|
| Boiling point( C ) | 5660 |
| Density( gcm⁻³ ) | 19.3@20°C |
| Element | Value |
|---|---|
| Melting point( C ) | 3410 |
| Latent heat of evaporation( J g⁻¹ ) | 4009 |
| Latent heat of fusion( J g⁻¹ ) | 192 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 133@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 173@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 4.5@0-100°C |
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |