Tungsten/Copper Alloy Foil (W65/Cu35)

Tungsten Copper Alloy Foil (W65/Cu35) offers enhanced arc resistance, mechanical stability, and conductivity, with 65% tungsten providing structural endurance and 35% copper delivering effective heat and electrical transfer. The foil form allows integration into thin layers for shielding, electrical interfacing, and heat management in aerospace, electronics, and defense sectors. Specific applications include high-voltage switching contacts, thermal management foils in aerospace sensors, and arc-resistant foils in power electronics. Research employs W65/Cu35 foils to study the relationship between tungsten phase distribution and conductivity, thermal expansion mismatch effects, and erosion resistance under high-current cycling. Its combination of toughness, conductivity, and thin-film applicability ensures broad relevance in high-performance electrical systems, aerospace technologies, and scientific research where stability and functionality are critical.