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Formula: W 80/Cu 20
Form: Foil (Light Tight)
Material: Tungsten/Copper
Commodity: Alloys
Thickness: 3mm
Light Tight: Light Tight

Tungsten/Copper Alloy Foil (Light Tight) (W80/Cu20)

Tungsten Copper Alloy Foil Light Tight (W80/Cu20) combines the extreme strength and high-temperature endurance of tungsten with copper’s superior electrical and thermal conductivity, manufactured in a foil free of pinhole defects for maximum integrity. With 80% tungsten, the foil exhibits excellent arc erosion resistance, dimensional stability, and wear resistance, while the copper content provides efficient heat dissipation and electrical conduction. Industries including aerospace, defense, and high-power electronics use W80/Cu20 foils in light-blocking and conductive applications. Specific uses include shielding layers in vacuum electronic devices, pinhole-free optical barriers in photonic systems, and conductive foils for aerospace sensor packaging. In research, W80/Cu20 light-tight foils are examined for thermal cycling endurance, microstructural stability, and defect prevention strategies. Their dual role as an electrically conductive and pinhole-free structural barrier makes them indispensable in advanced electronic and defense systems.
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Material Properties for Alloys

Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 4.1
Temperature coefficient( K⁻¹ ) -
Physical Properties
Element Value
Density( gcm⁻³ ) 15.4
Mechanical Properties
Element Value
Tensile strength( MPa ) 675
Thermal Properties
Element Value
Thermal conductivity( W m⁻¹ K⁻¹ ) 145@23°C

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