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Titanium Sputtering Target

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Composition: Ti Form: Sputtering Target Material: Titanium CAS Number: 7440-32-6 Commodity: Metals Purity: 99.99%
Titanium Sputtering Target is a high-purity titanium source for physical vapor deposition (PVD) processes, enabling precise and uniform thin-film formation. The dense, homogeneous target ensures consistent sputtering performance, producing coatings with excellent adhesion, controlled thickness, and desired microstructure. Industries including microelectronics, optics, and biomedical engineering rely on titanium sputtering targets for creating conductive adhesion layers, biocompatible coatings, and corrosion-resistant optical films. Specific applications include forming titanium seed layers in semiconductor manufacturing, depositing anti-reflective coatings on optical lenses, and producing bioactive surfaces on medical implants. In research, these targets are essential for exploring film growth kinetics, interface properties, and multilayer coating architectures. Titanium sputtering targets combine chemical stability, ease of deposition, and broad applicability, making them indispensable in advanced thin-film technologies.
Starting at $225.00 each
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Material Properties

Atomic Properties
Element Value
Atomic number 22
Crystal structure Hexagonal close packed
Electronic structure Ar 3d² 4s²
Valences shown 2,3,4
Atomic weight( amu ) 47.88
Thermal neutron absorption cross-section( Barns ) 6.1
Photo-electric work function( eV ) 4.1
Natural isotope distribution( Mass No./% ) 50/ 5.3
Natural isotope distribution( Mass No./% ) 49/ 5.5
Natural isotope distribution( Mass No./% ) 46/ 8.0
Natural isotope distribution( Mass No./% ) 48/ 73.7
Natural isotope distribution( Mass No./% ) 47/ 7.5
Atomic radius - Goldschmidt( nm ) 0.147
Ionisation potential( No./eV ) 3/ 27.5
Ionisation potential( No./eV ) 4/ 43.3
Ionisation potential( No./eV ) 5/ 99.2
Ionisation potential( No./eV ) 1/ 6.82
Ionisation potential( No./eV ) 2/ 13.6
Ionisation potential( No./eV ) 6/ 119
Mechanical Properties
Element Value
Material condition Polycrystalline
Material condition Annealed
Poisson's ratio 0.361
Poisson's ratio 0.361
Poisson's ratio -
Bulk modulus( GPa ) 108.4
Bulk modulus( GPa ) -
Bulk modulus( GPa ) 108.4
Tensile modulus( GPa ) -
Tensile modulus( GPa ) 120.2
Tensile modulus( GPa ) 120.2
Izod toughness( J m⁻¹ ) 61
Izod toughness( J m⁻¹ ) 61
Hardness - Vickers( kgf mm⁻² ) 60
Hardness - Vickers( kgf mm⁻² ) 60
Tensile strength( MPa ) 230-460
Tensile strength( MPa ) 230-460
Yield strength( MPa ) 140-250
Yield strength( MPa ) 140-250
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 54@20°C
Superconductivity critical temperature( K ) 0.4
Temperature coefficient( K⁻¹ ) 0.0038@0-100°C
Physical Properties
Element Value
Boiling point( C ) 3287
Density( gcm⁻³ ) 4.5@20°C
Thermal Properties
Element Value
Melting point( C ) 1660
Latent heat of evaporation( J g⁻¹ ) 8893
Latent heat of fusion( J g⁻¹ ) 365
Specific heat( J K⁻¹ kg⁻¹ ) 523@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 21.9@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 8.9@0-100°C
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Available Configurations

Properties common to all products in this list

Composition: Ti Form: Sputtering Target Material: Titanium CAS Number: 7440-32-6 Commodity: Metals Purity: 99.99%

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Tolerances

Disk
Thickness <0.01mm ±25%
Thickness =<0.05mm ±15%
Thickness >0.05mm ±10%
Diameter ±0.5mm