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Formula: TiB₂
Form: Sputtering Target
Material: Titanium Boride
CAS Number: 12045-63-5
Commodity: Compounds
Diameter: 50mm

Titanium Boride Sputtering Target

Titanium Boride Sputtering Target is engineered for producing thin films with high hardness, excellent adhesion, and corrosion resistance. The sputtering target form ensures uniform material deposition, making it ideal for advanced coating applications in electronics, optics, and tooling. Industries use TiB₂ targets for creating wear-resistant coatings on cutting tools, conductive layers in microelectronics, and protective optical films. Specific applications include deposition of TiB₂ layers on aerospace turbine blades, forming anti-wear coatings for molds, and producing conductive barriers in semiconductor devices. In research, titanium boride sputtering targets are key to developing next-generation protective coatings and functional films with tailored electrical and tribological properties. This combination of deposition precision and material performance underpins their value in high-tech manufacturing and materials science research.
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Material Properties for Compounds

Physical Properties
Element Value
Density( gcm⁻³ ) 4.5

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