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Composition: Sn 60/Pb 39/Sb 1
Form: Foil (Light Tight)
Material: Tin/Lead/Antimony
Commodity: Alloys
Light Tight: Light Tight

Tin/Lead/Antimony Alloy Foil (Light Tight) (Sn60/Pb39/Sb 1)

Tin/Lead/Antimony Alloy Foil Light Tight (Sn60/Pb39/Sb1) combines the solderability and corrosion resistance of tin, the ductility and low creep of lead, and the hardness enhancement provided by antimony. This formulation is particularly suited for electrical soldering, bearing lining, and high-strength bonding where light impermeability is required. Industries such as electronics, aerospace, and precision instrumentation use this foil for manufacturing high-reliability solders, shielding sensitive components from light, and creating wear-resistant overlays. Specific applications include joining aerospace wiring harnesses, forming light-tight seals in optical devices, and producing robust electrical junctions in high-vibration environments. The light-tight foil ensures no pinhole transmission, preserving integrity in both functional and protective roles.

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Material Properties for Alloys

Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 14.8
Thermal Properties
Element Value
Melting point( C ) 183
Thermal conductivity( W m⁻¹ K⁻¹ ) 50.2@23
Thermal conductivity( W m⁻¹ K⁻¹ ) 50.2@23C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 24@15-110°C
Physical Properties
Element Value
Density( gcm⁻³ ) 8.42

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