Tin/Lead/Antimony Alloy Disk (Sn60/Pb39/Sb1)

Tin Lead Antimony Alloy Disk (Sn60/Pb39/Sb1) features the same enhanced hardness and thermal stability of the coil form, but its precision-machined disk geometry makes it ideal for uniform melting and deposition in localized soldering and metallization processes. The alloy’s balance of flowability and mechanical strength enables its use in electronics assembly, component prototyping, and specialized joining operations. Industries including defense electronics, renewable energy systems, and high-reliability instrumentation employ these disks for targeted solder application. Specific uses include preform soldering in sensor assemblies, brazing in compact mechanical systems, and forming durable conductive pathways in research prototypes. Its consistent composition and form factor support precise control in both industrial and experimental settings.

Quick Links:

Tolerance

Properties

Reference & Citations

Acute toxicity

Serious health hazard

each

Tolerances

Disc

Thickness	>0.05mm	±10%
Thickness	<0.01mm	±25%
Thickness	0.01mm - 0.05mm	±15%

Material Properties for Alloys

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	14.8

Thermal Properties

Element	Value
Melting point( C )	183
Thermal conductivity( W m⁻¹ K⁻¹ )	50.2@23
Thermal conductivity( W m⁻¹ K⁻¹ )	50.2@23C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	24@15-110°C