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Tin Foil (Light Tight)

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Properties common to all products in this list

Commodity: Metals Material: Tin Form: Foil (Light Tight) Composition: Sn CAS Number: 7440-31-5 Opacity: Light Tight
Purity Thickness Sides Temper Options Other Variants
98.8% (1N88) to 99.999% (5N) 0.006mm (foil) to 6mm (plate) 10mm to 1600mm As Rolled Non Light Tested

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Tin Foil (Light Tight) (98.8–99.999% purity) is a pinhole-free metallic foil combining complete opacity to visible and near-visible light with the exceptional malleability, corrosion resistance, and non-toxic character that distinguish tin from other light-tight foil metals. Its extreme softness allows it to conform to irregular surfaces and wrap around components with reliable barrier continuity — a practical advantage over stiffer light-tight foils in assemblies where tight contact with non-planar geometries is required. Its chemical inertness and non-toxicity make it suitable for light-tight applications in food-contact, pharmaceutical, and cleanroom environments where copper or stainless alternatives would introduce contamination concerns. The availability of purity grades from 1N88 through to 5N allows grade selection matched to the sensitivity of the shielded environment, with 5N grades suited to analytical and electronic applications where trace metallic impurities must be minimized. Tin's superconducting transition below 3.722 K also makes light-tight tin foil relevant in cryogenic optical isolation applications. Typical uses include photosensitive detector shielding in analytical instruments, light-tight packaging for radiation-sensitive materials, and optical isolation enclosures in low-contamination environments.
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Key Features

Tin Foil (Light Tight) at 98.8–99.999% purity is a pinhole-free metallic foil combining complete opacity to visible and near-visible light with the exceptional malleability, corrosion resistance, and non-toxic character that distinguish tin from other light-tight foil metals:

Pinhole-Free Light Barrier with Extreme Conformability — Adapts to Non-Planar Geometries

Tin's extreme softness allows Tin Foil (Light Tight) to conform to irregular surfaces and wrap around components with reliable barrier continuity — a practical advantage over stiffer light-tight foils in assemblies where tight contact with non-planar geometries is required to maintain the optical barrier without gaps or lifting at curved or stepped surfaces.

Non-Toxic & Chemically Inert for Food-Contact, Pharmaceutical & Cleanroom Environments

Tin's chemical inertness and non-toxicity make Tin Foil (Light Tight) suitable for light-tight shielding applications in food-contact, pharmaceutical, and cleanroom environments where copper, stainless, or aluminium light-tight foil alternatives would introduce contamination concerns — extending the application range of metallic light-tight barriers into regulated and low-contamination environments where other foil metals are not acceptable.

Purity Range 1N88 to 5N for Contamination-Sensitive Grade Selection

Purity options from 1N88 through to 5N allow grade selection matched to the sensitivity of the shielded environment — lower grades suit packaging, industrial detector protection, and general optical isolation; 5N grade is selected for analytical and electronic applications where trace metallic impurities from the light-tight foil must be minimized, and for research environments where foil material purity is an experimental variable.

Superconducting Below 3.722 K for Cryogenic Optical Isolation Applications

Tin's superconducting transition below 3.722 K makes high-purity Tin Foil (Light Tight) relevant to cryogenic optical isolation applications where the enclosure foil becomes superconducting at the operating temperature of the detector or instrument — providing simultaneous light exclusion and superconducting enclosure behavior in low-temperature physics apparatus.

Low Melting Point (231.9 °C) Enables Bonded Light-Tight Seals at Low Temperature

A melting point of 231.9 °C enables the foil to be used as a light-tight bonded seal at low process temperatures — supporting the fabrication of hermetically joined optical isolation enclosures where the tin foil both defines the light-tight barrier and provides the bonding material for the sealed joint, without the high-temperature processing that would damage thermally sensitive photonic or electronic components inside the enclosure.

Industrial Applications

Tin Foil (Light Tight) is used across analytical instrument shielding, radiation-sensitive packaging, cryogenic optical isolation, and cleanroom optical barrier applications wherever a non-toxic, highly conformable metallic light-tight foil is required in environments that exclude copper or aluminium alternatives:

Photosensitive Detector Shielding in Analytical Instruments
Used as photosensitive detector shielding in analytical instruments, where the pinhole-free construction provides complete optical isolation of detector elements and tin's conformability ensures reliable barrier contact at complex detector housing geometries — with non-toxicity and chemical inertness allowing deployment in analytical environments where copper light-tight foil contamination of sensitive detector surfaces would compromise measurement accuracy.
Light-Tight Packaging for Radiation-Sensitive Materials
Applied as light-tight packaging for radiation-sensitive photographic, pharmaceutical, and analytical materials, where tin's established non-toxicity, chemical compatibility with packaged products, and complete optical barrier performance — combined with the coil-format availability for high-volume converting — support the production of primary light-tight packaging for photosensitive materials in food-contact and pharmaceutical environments.
Optical Isolation Enclosures in Low-Contamination Environments
Used as the enclosure foil for optical isolation in cleanroom and low-contamination environments where the light-tight barrier must not introduce metallic contamination into the shielded space — with tin's non-toxicity and chemical inertness enabling deployment in semiconductor process environments, pharmaceutical analytical instruments, and food safety testing apparatus where alternative light-tight foil metals are not permitted.
Cryogenic Optical Isolation in Low-Temperature Physics Apparatus
High-purity Tin Foil (Light Tight) is used in cryogenic optical isolation of photosensitive detectors in low-temperature physics apparatus, where the foil's superconducting transition at 3.722 K means the light-tight enclosure becomes superconducting at the operating temperature of the detector — providing optical isolation, electromagnetic shielding from the Meissner effect, and structural enclosure function in a single foil component.
Bonded Light-Tight Seals in Photonic & Electronic Component Assembly
Applied as bonded light-tight seals in photonic and electronic component assembly, where a melting point of 231.9 °C allows the tin foil to serve simultaneously as the optical barrier material and the low-temperature bonding medium for sealed joints — enabling the fabrication of hermetically sealed, optically isolated component enclosures without the high-temperature processing that would damage thermally sensitive photonic or electronic elements inside the sealed assembly.

Material Properties

Atomic Properties
Element Value
Atomic number 50
Crystal structure Tetragonal
Electronic structure Kr 4d¹⁰ 5s² 5p²
Valences shown 2,4
Atomic weight( amu ) 118.69
Thermal neutron absorption cross-section( Barns ) 0.63
Photo-electric work function( eV ) 4.3
Natural isotope distribution( Mass No./% ) 122/ 4.6
Natural isotope distribution( Mass No./% ) 124/ 5.6
Natural isotope distribution( Mass No./% ) 114/ 0.7
Natural isotope distribution( Mass No./% ) 120/ 32.4
Natural isotope distribution( Mass No./% ) 118/ 24.3
Natural isotope distribution( Mass No./% ) 112/ 1.0
Natural isotope distribution( Mass No./% ) 116/ 14.7
Natural isotope distribution( Mass No./% ) 115/ 0.4
Natural isotope distribution( Mass No./% ) 117/ 7.7
Natural isotope distribution( Mass No./% ) 119/ 8.6
Atomic radius - Goldschmidt( nm ) 0.158
Ionisation potential( No./eV ) 2/ 14.63
Ionisation potential( No./eV ) 5/ 72.3
Ionisation potential( No./eV ) 3/ 30.5
Ionisation potential( No./eV ) 4/ 40.7
Ionisation potential( No./eV ) 1/ 7.34
Mechanical Properties
Element Value
Hardness - Mohs 1.5-1.8
Material condition Polycrystalline
Poisson's ratio 0.357
Bulk modulus( GPa ) 58.2
Tensile modulus( GPa ) 49.9
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 12.6@20°C
Superconductivity critical temperature( K ) 3.722
Temperature coefficient( K⁻¹ ) 0.0046@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.42
Physical Properties
Element Value
Boiling point( C ) 2270
Density( gcm⁻³ ) 7.28@20°C
Thermal Properties
Element Value
Melting point( C ) 231.9
Latent heat of evaporation( J g⁻¹ ) 2497
Latent heat of fusion( J g⁻¹ ) 59.6
Specific heat( J K⁻¹ kg⁻¹ ) 213@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 66.8@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 23.5@0-100°C
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Available Configurations

Properties common to all products in this list

Commodity: Metals Material: Tin Form: Foil (Light Tight) Composition: Sn CAS Number: 7440-31-5 Opacity: Light Tight

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Tolerances

Foil (Light Tight)
Thickness <0.01mm ±25%
Thickness 0.01mm - 0.05mm ±15%
Thickness >0.05mm ±10%
Linear dimension <100mm ±1mm
Linear dimension >=100mm +2 / -1%