Silver/Copper Alloy Foil (Light Tight) (AG95/Cu5)

Silver Copper Alloy Foil (Light Tight) (Ag95/Cu5) delivers superior conductivity from its high silver content while maintaining durability and formability through copper alloying, presented in a foil guaranteed free of pinholes to block all external light. This light-tight performance is critical for precision optics, sensors, and research instruments where stray light compromises measurements. Industries including photonics, aerospace, and defense employ this foil in spectrometer housings, detector shielding, and high-precision optical assemblies. Specific uses include low-noise camera isolation, quantum optics experiments, and photonic circuit protection. Research explores its role in improving measurement reproducibility, minimizing background noise, and supporting ultra-sensitive imaging platforms. The foil format provides thin yet robust coverage, enabling reliable integration into both industrial shielding systems and advanced experimental setups.

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Properties

Reference & Citations

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Material Properties for Alloys

Mechanical Properties

Element	Value
Hardness - Brinell	0
Hardness - Rockwell	0
Elongation at break( % )	0
Modulus of elasticity( GPa )	0
Tensile modulus( GPa )	0
Izod impact strength( J m⁻¹ )	0
Hardness - Vickers( kgf mm⁻² )	0
Shear strength( MPa )	0
Tensile strength( MPa )	0

Magnetic Properties

Element	Value
Initial permeability	0
Maximum permeability	0
Coercivity (Hc)( A m⁻¹ )	0
Curie temperature( C )	0
Remanence from saturation (Brem)( T )	0
Saturation flux density( T )	0
Saturation Induction( T )	0

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	0
Temperature coefficient( K⁻¹ )	0

Thermal Properties

Element	Value
Crystallisation temperature( C )	0
Maximum use temperature in air( C )	0
Melting point( C )	0
Temperature - Austenitic( C )	0
Temperature - Martensitic( C )	0
Specific heat( J K⁻¹ kg⁻¹ )	0
Thermal conductivity( W m⁻¹ K⁻¹ )	0
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	0