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Formula: Sialon
Form: Foil/Film/Sheet
Material: Silicon Nitride/Aluminum Nitride/Aluminum Oxide
Commodity: Ceramics

Silicon Nitride/Aluminum Nitride/Alumina Sheet

Silicon Nitride Aluminium Nitride Alumina Sheet integrates high strength, thermal conductivity, and chemical stability in a multilayer ceramic form optimized for advanced engineering. Its dielectric properties and thermal management capacity make it essential in microelectronics, high-frequency devices, and protective coatings. Industries such as aerospace, automotive, and energy employ these sheets in substrates for semiconductors, heat spreaders, and insulation barriers. Specific applications include LED packaging, ion barrier coatings, and substrates for microwave circuits, where their wide band gap and low dielectric loss ensure device reliability. Research directions explore epitaxial film growth, lattice-matched heterostructures, and protective bio-coatings, demonstrating their role in next-generation optoelectronics and biomedical implants. Combining the complementary properties of Si₃N₄, AlN, and Al₂O₃ into sheet form provides mechanical robustness and electronic versatility, ensuring widespread impact across industrial and research frontiers.
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Tolerances

Foil/Film/Sheet
Thickness ±20%

Material Properties for Ceramics

Chemical Resistance
Element Value
Acids - concentrated Good
Acids - dilute Good
Alkalis Fair
Physical Properties
Element Value
Apparent porosity( % ) 0.01
Density( gcm⁻³ ) 3.24
Thermal Properties
Element Value
Upper continuous use temperature( C ) 1000
Specific heat( J K⁻¹ kg⁻¹ ) 620-710@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 20@20°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 3.3-3.7@20-1000°C
Mechanical Properties
Element Value
Tensile modulus( GPa ) 280-300
Hardness - Vickers( kgf mm⁻² ) 1650-1800
Tensile strength( MPa ) 400-450
Pultrusions
Element Value
Compressive strength( MPa ) >3500
Electrical Properties
Element Value
Volume resistivity( Ohmcm ) 10¹²-10¹⁷@25

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