Platinum Sputtering Target

Platinum Sputtering Target combines high purity, excellent conductivity, and outstanding chemical stability, making it a premier material for thin-film deposition. Its engineered geometry ensures uniform erosion during sputtering, providing consistent coating quality for electronics, optics, and energy devices. Industries such as semiconductor manufacturing, photonics, and renewable energy use platinum sputtering targets for producing conductive layers, corrosion-resistant coatings, and catalytic films. Specific applications include creating interconnects in microchips, optical coatings for sensors, and catalyst layers for fuel cells. In research, platinum sputtering targets are key in developing novel thin-film materials with tailored electrical and catalytic properties. Their ability to deliver precision coatings under demanding conditions ensures ongoing importance in high-tech production and experimental science.

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Properties

Reference & Citations

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Material Properties for Precious Metals

Atomic Properties

Element	Value
Atomic number	78
Crystal structure	Face centred cubic
Electronic structure	Xe 4f¹⁴ 5d⁹ 6s¹
Valences shown	1,2,3,4
Atomic weight( amu )	195.08
Thermal neutron absorption cross-section( Barns )	9
Photo-electric work function( eV )	5.3
Natural isotope distribution( Mass No./% )	192/ 0.79
Natural isotope distribution( Mass No./% )	196/ 25.30
Natural isotope distribution( Mass No./% )	190/ 0.01
Natural isotope distribution( Mass No./% )	195/ 33.80
Natural isotope distribution( Mass No./% )	198/ 7.20
Natural isotope distribution( Mass No./% )	194/ 32.90
Atomic radius - Goldschmidt( nm )	0.138
Ionisation potential( No./eV )	1/ 9.0
Ionisation potential( No./eV )	2/ 18.6

Mechanical Properties

Element	Value
Material condition	Hard
Material condition	Soft
Poisson's ratio	0.39
Poisson's ratio	0.39
Bulk modulus( GPa )	276
Bulk modulus( GPa )	276
Tensile modulus( GPa )	170
Tensile modulus( GPa )	170
Hardness - Vickers( kgf mm⁻² )	40
Hardness - Vickers( kgf mm⁻² )	100
Tensile strength( MPa )	200-300
Tensile strength( MPa )	125-150
Yield strength( MPa )	14-35
Yield strength( MPa )	185

Electrical Properties

Element	Value
Electrical resistivity( µOhmcm )	10.58@20@20°C
Temperature coefficient( K⁻¹ )	0.00392@0-100°C

Physical Properties

Element	Value
Boiling point( C )	3827
Density( gcm⁻³ )	21.45@20°C

Thermal Properties

Element	Value
Melting point( C )	1772
Latent heat of evaporation( J g⁻¹ )	2405
Latent heat of fusion( J g⁻¹ )	101
Specific heat( J K⁻¹ kg⁻¹ )	133@025°C
Thermal conductivity( W m⁻¹ K⁻¹ )	71.6@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	9@0-100