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OFHC Copper Foil (Light Tight)
Available Configurations
Properties common to all products in this list
| Purity | Thickness | Sides | Temper Options | Surface Finish Options | Other Variants |
|---|---|---|---|---|---|
| 99.95% (3N5) to 99.999% (5N) | 0.006mm (foil) to 3mm (sheet) | 10mm to 1230mm | As Rolled, Annealed, Half Hard, Hard | Polished on both sides | OFHC Non Light Tested; Standard Non Light Tested |
Need custom configurations? Please contact us.
Key Features
OFHC Copper Foil (Light Tight) is an oxygen-free high conductivity copper foil available in purities from 99.95% (3N5) to 99.999% (5N), manufactured to a guaranteed pinhole-free structure that completely blocks visible and near-visible light — combining two properties that are rarely available together in a single metallic foil:
Guaranteed Pinhole-Free Light Barrier
Manufactured to a guaranteed pinhole-free structure, OFHC Copper Foil (Light Tight) completely blocks visible and near-visible light transmission — providing a reliable optical barrier that also serves as a high-performance thermal and electrical interface, a combination that is rarely available in a single metallic foil material.
Maximum Electrical & Thermal Performance (101% IACS, 401 W/m·K)
With electrical resistivity of 1.69 µΩ·cm, thermal conductivity of 401 W/m·K, and conductivity reaching 101% IACS, this foil delivers the maximum electrical and thermal performance of copper while simultaneously acting as a reliable optical barrier — uniquely suited to applications where an optical shield must also conduct heat or carry current.
Oxygen-Free Production Prevents Hydrogen Embrittlement
The oxygen-free production process eliminates dissolved oxygen and the oxide inclusions that cause hydrogen embrittlement in standard copper, making this foil fully compatible with high-temperature brazing, vacuum processing, and reducing-atmosphere environments where standard copper foils would fail — while also removing the inclusions that contribute to electron scattering and resistivity increase.
Low Outgassing & Ultra-High Vacuum Compatibility
Low outgassing behaviour and compatibility with precision cleaning protocols make OFHC Copper Foil (Light Tight) particularly well suited to ultra-high vacuum and cryogenic assemblies — including cryostat radiation baffles and beam stop components — where surface contamination and gas evolution are as critical as the foil's electromagnetic properties.
Purity Range 99.95% to 99.999% for Application-Specific Selection
Available from 99.95% (3N5) to 99.999% (5N) purity, this foil allows purity to be matched to application requirements — from demanding industrial shielding and vacuum applications at 3N5 through to the highest-specification research environments at 5N where trace impurity levels are experimental variables.
Industrial Applications
OFHC Copper Foil (Light Tight) is used across photonics, particle physics, cryogenics, and vacuum research wherever an optical barrier must also serve as a high-performance thermal or electrical interface in a vacuum-compatible assembly:
- ✦ Laser Isolation Chambers & Optical Enclosures
- Used in laser isolation chambers and optical enclosures requiring both light exclusion and high thermal conductivity, where the pinhole-free structure provides a complete optical barrier and thermal conductivity of 401 W/m·K simultaneously manages heat generated within the enclosed assembly.
- ✦ Detector & Sensor Shielding in Radiation-Sensitive Experiments
- Applied as detector and sensor shielding in radiation-sensitive experimental setups, where the guaranteed pinhole-free optical barrier prevents stray light from reaching sensitive detector elements while the oxygen-free copper construction ensures vacuum compatibility and freedom from outgassing contamination.
- ✦ Cryostat Radiation Baffles
- Employed as cryostat radiation baffles where low outgassing, compatibility with precision cleaning protocols, and reliable light exclusion across the full foil area are required in ultra-high vacuum and cryogenic assemblies — applications where surface contamination and optical leakage must both be eliminated.
- ✦ RF & EMI Shielding for Photosensitive Electronics
- Used for RF and EMI shielding in photosensitive electronic assemblies where the foil must simultaneously exclude light and provide electromagnetic shielding — a combination that requires both a pinhole-free optical barrier and the high electrical conductivity of oxygen-free copper at 101% IACS.
- ✦ Beam Stop Components in Photonics & Particle Physics
- Applied as beam stop components in photonics and particle physics experiments where an optical barrier must also serve as a high-performance thermal interface in a vacuum-compatible assembly, and where oxygen-free purity up to 99.999% ensures that material contamination does not affect experimental results.
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
| Linear dimension | <100mm | ±1mm |
| Linear dimension | >=100mm | +2 / -1% |