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OFHC Copper Foil
Available Configurations
Properties common to all products in this list
| Purity | Thickness | Sides | Temper Options | Other Variants |
|---|---|---|---|---|
| 99.95% to 99.99% | 0.006mm (foil) to 25.4mm (plate) | 10mm to 1000mm | As Rolled, Annealed, Half Hard, Hard, Soft | OFHC Light Tight; Non Light Tested |
Need custom configurations? Please contact us.
Key Features
OFHC Copper Foil is an oxygen-free high conductivity copper foil available in purities from 3N5 (99.95%) to 4N (99.99%), produced by a casting and rolling process that removes dissolved oxygen and minimises trace impurity levels below those of standard copper — delivering maximum electrical and thermal performance with full compatibility with high-temperature, vacuum, and reducing-atmosphere processing:
Oxygen-Free Production Prevents Hydrogen Embrittlement
Eliminating dissolved oxygen prevents the hydrogen embrittlement that degrades standard copper foil in high-temperature brazing, vacuum processing, and reducing-atmosphere environments — and removes the oxide inclusions that can contribute to electron scattering and resistivity increase in precision electrical applications where standard copper foil would fail under processing conditions.
Maximum Electrical & Thermal Performance (101% IACS, 401 W/m·K)
With electrical resistivity of 1.69 µΩ·cm at 20 °C, thermal conductivity of 401 W/m·K, and conductivity reaching 101% IACS, OFHC Copper Foil delivers the maximum electrical and thermal performance available in a copper sheet format — properties preserved because the oxygen-free process removes the inclusions that degrade conductivity in standard grades.
3N5 Grade for Demanding Industrial Applications
The 3N5 grade suits demanding industrial applications — precision EMI shielding, vacuum chamber liners, high-frequency circuit lamination, and superconducting device components — where oxygen-free processing is necessary for processing compatibility and electrical performance, but the highest purity level is not required.
4N Grade for Surface-Sensitive & Research Applications
The 4N grade provides lower trace impurity levels that improve surface chemistry, bonding reliability, and electrochemical consistency in thin-film substrate work, cryogenic assemblies, and research environments where traceable material purity is an experimental variable and the step up from 3N5 is justified by application requirements.
Low Outgassing & Ultra-High Vacuum Compatibility
Low outgassing behaviour and compatibility with precision cleaning protocols support OFHC Copper Foil's use in ultra-high vacuum systems, accelerator technology, quantum device fabrication, and experimental physics wherever standard copper foil would introduce unacceptable contamination risk or fail under processing conditions.
Industrial Applications
OFHC Copper Foil is used across electronics, vacuum technology, cryogenics, and research sectors where oxygen-free processing compatibility, maximum conductivity, and low outgassing are required in a copper sheet format:
- ✦ Precision EMI Shielding
- Used in precision EMI shielding applications where conductivity reaching 101% IACS and freedom from oxide inclusions deliver maximum shielding effectiveness, and where oxygen-free processing compatibility ensures the foil can be brazed or bonded at elevated temperatures without hydrogen embrittlement degrading the shield structure.
- ✦ Vacuum Chamber Liners & High-Frequency Circuit Lamination
- Employed as vacuum chamber liners and high-frequency circuit lamination stock where low outgassing, compatibility with precision cleaning protocols, and the absence of oxygen-related contamination sources ensure that OFHC foil does not degrade vacuum quality or introduce resistivity-increasing inclusions into high-frequency circuit structures.
- ✦ Superconducting Device Components
- Applied in superconducting device components where the 3N5 grade provides oxygen-free processing compatibility and maximum conductivity in cryogenic assemblies, and freedom from hydrogen embrittlement ensures that components survive the high-temperature bonding and reducing-atmosphere processing steps used in superconducting device fabrication.
- ✦ Thin-Film Substrate Work & Cryogenic Assemblies
- The 4N grade is used for thin-film substrate work and cryogenic assemblies where lower trace impurity levels improve surface chemistry, bonding reliability, and electrochemical consistency — applications where the step up from 3N5 is justified by the sensitivity of the process or experiment to trace impurity levels at the foil surface.
- ✦ Accelerator Technology, Quantum Device Fabrication & Experimental Physics
- Used across accelerator technology, quantum device fabrication, surface science, and experimental physics wherever standard copper foil would introduce unacceptable contamination risk or fail under processing conditions — providing a specification-controlled, low-outgassing foil stock with traceable purity for the most demanding research applications.
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
| Linear dimension | <100mm | ±1mm |
| Linear dimension | >=100mm | +2 / -1% |