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OFHC Copper Disk
Available Configurations
Properties common to all products in this list
Key Features
OFHC Copper is ≥99.95% copper produced to an oxygen content below 0.001%, combining the highest electrical and thermal performance of any copper disk format with full compatibility with high-temperature brazing, vacuum processing, and reducing-atmosphere environments:
Maximum Electrical & Thermal Performance (101% IACS, 401 W/m·K)
With conductivity reaching 101% IACS, electrical resistivity of 1.69 µΩ·cm, and thermal conductivity of 401 W/m·K, OFHC Copper delivers the highest electrical and thermal performance available in a copper disk format — properties preserved because the absence of oxygen removes the oxide inclusions that contribute to electron scattering and resistivity increase in lower-purity grades.
Oxygen Content Below 0.001% Prevents Hydrogen Embrittlement
Produced to an oxygen content below 0.001%, OFHC Copper eliminates the hydrogen embrittlement that makes standard copper unsuitable for high-temperature brazing, vacuum processing, and reducing-atmosphere environments — ensuring full compatibility with the most demanding assembly and processing conditions encountered in cryogenic and vacuum system fabrication.
Low Outgassing & Vacuum Compatibility
OFHC Copper low outgassing behaviour and compatibility with precision cleaning protocols make it a direct-fit component for ultra-high vacuum surface science, vacuum chamber interface components, and cryogenic contact pad applications, where surface cleanliness and the absence of gas evolution are as critical as bulk material properties.
Precision Circular Geometry for Assembly Applications
The precision-cut circular geometry and dimensional consistency of OFHC Copper Disk make it a direct-fit component for demanding assembly applications — thermal spreaders, cold-plate interfaces, RF electrode surfaces, and electrical contact substrates — where dimensional accuracy and surface cleanliness matter as much as bulk material properties.
Traceable Purity for Research & Metrology
At ≥99.95% purity with verified oxygen content, OFHC Copper Disk provides the material traceability required for thermal diffusivity measurements, electromagnetic coupling experiments, and thin-film deposition substrate work in research environments where maximum conductivity and reliable vacuum compatibility are non-negotiable experimental requirements.
Industrial Applications
OFHC Copper Disk is used across power electronics, cryogenics, particle physics, vacuum technology, and research sectors where maximum conductivity, verified purity, and vacuum compatibility are required in a precision circular form:
- ✦ Thermal Spreaders & Cold-Plate Interfaces
- Used as thermal spreaders and cold-plate interfaces in high-power electronics and laser systems, where thermal conductivity of 401 W/m·K and the absence of oxide inclusions ensure the most efficient heat transfer available from a copper disk component into cooling systems and heat sinks.
- ✦ Cryogenic Contact Pads in Superconducting Apparatus
- Employed as cryogenic contact pads in superconducting apparatus, where OFHC copper's freedom from hydrogen embrittlement, maximum conductivity, and low outgassing support reliable electrical and thermal contact at cryogenic temperatures without degradation under the thermal cycling and vacuum conditions of superconducting system operation.
- ✦ RF Electrode Surfaces in Particle Accelerators
- Applied as RF electrode surfaces in particle accelerators, where conductivity reaching 101% IACS, low outgassing, and compatibility with precision cleaning protocols are required to maintain RF cavity performance and vacuum quality under the demanding operating conditions of accelerator systems.
- ✦ Vacuum Chamber Interface Components
- Used as vacuum chamber interface components where precision circular geometry, low outgassing, and freedom from oxygen-related contamination sources provide dimensional consistency and surface cleanliness in assemblies where both the mechanical fit and the vacuum compatibility of the interface component are critical.
- ✦ Thermal Diffusivity Measurements & Research Substrates
- Used in thermal diffusivity measurements, electromagnetic coupling experiments, and thin-film deposition substrate work in research, where verified purity, maximum conductivity, and reliable vacuum compatibility provide a traceable, specification-controlled platform for experiments where material properties are experimental variables rather than background assumptions.
Tolerances
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
| Diameter | ±0.5mm |