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Nickel Oxide Sputtering Target

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Properties common to all products in this list

Composition: NiO Form: Sputtering Target Material: Nickel Oxide CAS Number: 1313-99-1 Commodity: Compounds Thickness: 3mm Production Method: Hot Pressed
Nickel Oxide Sputtering Target is a dense, high-purity form of NiO optimized for physical vapor deposition (PVD) processes. With excellent chemical stability and uniform composition, it enables deposition of thin films with controlled stoichiometry and functional properties. Industries such as optoelectronics, renewable energy, and microelectronics use NiO targets for transparent conductive layers, hole transport layers in photovoltaics, and electrochromic coatings. Key applications include thin-film solar cells, smart windows, and thin-film transistors. In research, nickel oxide sputtering targets are pivotal for developing next-generation devices with improved efficiency, stability, and functional integration. Their ability to produce consistent, defect-minimized films makes them vital for both prototyping and mass production.

Health hazard/Hazardous to the ozone layer

Serious health hazard

Starting at $520.00 each
No Minimum order Free technical support *Free delivery worldwide

Material Properties

Thermal Properties
Element Value
Melting point( C ) 1984
Physical Properties
Element Value
Density( gcm⁻³ ) 6.67
each

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Available Configurations

Properties common to all products in this list

Composition: NiO Form: Sputtering Target Material: Nickel Oxide CAS Number: 1313-99-1 Commodity: Compounds Thickness: 3mm Production Method: Hot Pressed

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