Tin

Tin

Tin (Sn) is a soft, silvery-white metal known for its malleability, low melting point, and excellent corrosion resistance. It melts at 231.9 °C and exhibits good ductility and thermal conductivity. Tin forms a protective oxide layer that prevents further oxidation, making it valuable for coating other metals.

Goodfellow’s Tin product range, including Tin Bars, Tin Coils (rolled sheets), and Tin Sputtering Targets, is essential for advanced research and industrial applications. Known for its excellent corrosion resistance and solderability, Tin is crucial in electronics, metallurgy, and nanotechnology. Our high-purity Tin products, such as Tin Foil (Light Tight) and tin powder, are sought after in semiconductor research, precision engineering, and microelectronics, enabling advancements in surface coatings and energy storage technologies. Tin’s unique properties make it indispensable in the development of next-generation materials for energy conversion. Goodfellow’s high-purity tin materials support breakthrough research and development in university laboratories and R&D facilities globally.



General Properties

PropertyValue
Atomic Number50
Density7.31 g/cm³
Melting Point231.9 °C
Boiling Point2602 °C
Thermal Conductivity66.8 W/m·K
Electrical Resistivity115 nΩ·m
Crystal StructureTetragonal (white tin), Cubic (gray tin)

Mechanical Properties

PropertyValue
Tensile Strength14–18 MPa (pure tin)
Yield Strength12–15 MPa
Young’s Modulus50 GPa
HardnessBrinell 4–5
Elongation at Break40–50%
Poisson’s Ratio0.36

Chemical Properties

PropertyValue
Corrosion ResistanceGood, especially in mild acids and alkalis
ReactivityStable; forms passive oxide layer
Oxidation States+2, +4
Surface OxideTin oxide (SnO2)
IdentifierValue
SymbolSn
Atomic Number50
CAS Number7440-31-5
UN NumberUN3077 (solid), UN3089 (powder)
EINECS Number231-141-8
IsotopeTypeNotes
Sn-112Stable5.79% natural abundance
Sn-114Stable0.66%
Sn-116Stable14.54%
Sn-117Stable7.68%
Sn-118Stable24.22%
Sn-119Stable8.59%
Sn-120Stable32.58%
Sn-122Stable4.63%
Sn-124Stable5.79%

Scientific Applications

Use CaseDescription
Superconductivity ResearchUsed in low-temperature superconductors and quantum materials
Thin-Film CoatingsTin oxide films for transparent conducting electrodes
Nuclear MedicineTin isotopes used in diagnostic imaging
Sensor TechnologiesTin-based nanomaterials for gas and biosensors
CatalysisTin catalysts for organic synthesis reactions

Industrial Applications

Use CaseDescription
SolderingPrimary component in lead-free solder alloys for electronics
Coatings and PlatingCorrosion-resistant coatings for food packaging and steel
Battery ComponentsUsed in lead-acid batteries and emerging battery technologies
Organotin CompoundsBiocides, stabilizers, and catalysts in PVC production
Glass ManufacturingTin oxide used as a polishing agent and coating for glass
Grade Typical Impurities Applications
97.4% (1N74) Higher impurities (thousands ppm) Basic industrial use, coatings
98.8% (1N88) Cu, Pb, Sb, Fe < 1200 ppm General industrial use, coatings
99.4% (2N4) Cu, Pb, Sb, Fe < 600 ppm Basic soldering, alloys
99.75% (2N75) Cu, Pb, Sb, Fe < 250 ppm Improved soldering, electronics
99.9% (3N) Cu, Pb, Sb, Fe < 100 ppm General purpose, solder, coating
99.95% (3N5) Cu, Pb, Sb, Fe < 50 ppm Electronics, research
99.99% (4N) Cu, Pb, Sb, Fe < 10 ppm Advanced electronics, thin films, research
99.995% (4N5) Cu, Pb, Sb, Fe < 5 ppm Advanced lab, industrial use
99.999% (5N) Cu, Pb, Sb, Fe < 1 ppm High-purity research, semiconductor, coatings
99.9999% (6N) Ultra-low impurities Cutting-edge research, ultra-high purity applications
Synonym
Tin Metal
Sn
Stannum
Étain (French)
Estaño (Spanish)