Kapton® HN Polyimide Film

Kapton® HN Polyimide Film is the industry benchmark for all-purpose polyimide insulation, offering exceptional dielectric strength, radiation resistance, and temperature endurance from −269 °C to +400 °C. It exhibits high dimensional stability, low outgassing, and resistance to chemicals and solvents, making it a staple in aerospace wiring, microelectronics, cryogenics, and high-energy physics labs. It is the go-to material for cable insulation in spacecraft, nuclear reactors, and fusion research. Notably, Kapton® HN films have proven effective in beam diagnostics, ion-beam imaging, and radiation-curing composite interfaces. Surface modifications, such as plasma-activated POSS coatings, enhance its utility for adhesion-sensitive applications. With a long legacy of reliability in harsh conditions, Kapton® HN Polyimide Film remains essential to precision engineering, space exploration, and high-voltage miniaturized systems, offering unmatched consistency and environmental resilience.

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Tolerance

Properties

Reference & Citations

each

Tolerances

Foil

Thickness		±20%

Material Properties for Polymers

Chemical Resistance

Element	Value
Acids - concentrated	Poor
Acids - dilute	Fair
Alcohols	Poor
Alkalis	Poor
Aromatic hydrocarbons	Good
Greases and Oils	Good
Halogenated Hydrocarbons	Good
Halogens	Fair
Ketones	Good

Mechanical Properties

Element	Value
Coefficient of friction	0.42
Hardness - Rockwell	E52-99
Elongation at break( % )	Aug-70
Tensile modulus( GPa )	2.0 – 3.0
Izod impact strength( J m⁻¹ )	80
Tensile strength( MPa )	70-150

Electrical Properties

Element	Value
Dielectric constant @1MHz	3.4
Dissipation factor @ 1kHz	0.0018
Dielectric strength( kV mm⁻¹ )	22
Surface resistivity( Ohm/sq )	10¹⁶
Volume resistivity( Ohmcm )	10¹⁸

Physical Properties

Element	Value
Flammability	V0
Radiation resistance	Good
Refractive index	1.66
Resistance to Ultra-violet	Poor
Limiting oxygen index( % )	53
Water absorption - over 24 hours( % )	0.2-2.9
Density( gcm⁻³ )	1.42

Thermal Properties

Element	Value
Heat-deflection temperature - 1.8MPa( C )	360
Lower working temperature( C )	-270
Upper working temperature( C )	250-320
Specific heat( J K⁻¹ kg⁻¹ )	1090
Thermal conductivity( W m⁻¹ K⁻¹ )	0.1-0.35@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ )	30-60