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Composition: In 50/Sn 50
Form: Foil/Film/Sheet
Material: Indium/Tin
Commodity: Alloys
Indium Tin Alloy Foil (In50/Sn50) combines low melting temperature, strong wetting behavior, and excellent solderability in a thin sheet ideal for coating, bonding, and sealing. Its eutectic composition provides stable melting characteristics, ensuring reliable performance in delicate assemblies. Industries such as electronics, photonics, and cryogenics employ this foil for solder layers in microchips, vacuum seals in optical devices, and bonding in superconducting systems. Technologies benefiting include semiconductor packaging, optoelectronic device integration, and precision thermal interface materials. Research explores its diffusion behavior, intermetallic formation, and stability in long-term service environments. The foil form allows uniform application over large surfaces, improving contact quality and reproducibility in both experiments and industrial processes. By offering consistency, adaptability, and low-temperature joining, this alloy foil is essential in advanced microelectronic and optical engineering.
Tolerances
Foil
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±25% |
| Thickness | >0.05mm | ±10% |
Material Properties for Alloys
Mechanical Properties
| Element | Value |
|---|---|
| Elongation at break( % ) | 83 |
| Shear strength( MPa ) | 11 |
| Tensile strength( MPa ) | 12 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 15 |
| Temperature coefficient( K⁻¹ ) | - |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 125 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 34@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 20@20-100°C |
Physical Properties
| Element | Value |
|---|---|
| Density( gcm⁻³ ) | 7.3 |
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