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Formula: In 50/Sn 50
Form: Disk
Material: Indium/Tin
Commodity: Alloys
Indium Tin Alloy Disk (In50/Sn50) offers excellent solderability, low melting temperature, and good wetting properties in a compact circular format ideal for sealing and bonding applications. The eutectic balance of indium and tin ensures reliable performance with reduced brittleness compared to pure solders. Industries such as electronics, aerospace, and optics use this alloy disk in precision soldering, vacuum sealing, and joining sensitive assemblies. Technologies benefiting include semiconductor die-attach, sealing of optical housings, and integration of low-temperature superconducting components. Research explores microstructural stability, intermetallic formation, and optimization of solder joints in advanced packaging systems. The disk form ensures consistent geometry and uniform bonding in controlled experiments and high-reliability systems. Its combination of low-temperature operability and bonding versatility makes In50/Sn50 alloy disks critical for precision manufacturing and advanced materials research.
Tolerances
Disc
| Thickness | >0.05mm | ±10% |
|---|---|---|
| Thickness | <0.01mm | ±25% |
| Thickness | 0.01mm - 0.05mm | ±15% |
Material Properties for Alloys
Mechanical Properties
| Element | Value |
|---|---|
| Elongation at break( % ) | 83 |
| Shear strength( MPa ) | 11 |
| Tensile strength( MPa ) | 12 |
Electrical Properties
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 15 |
| Temperature coefficient( K⁻¹ ) | - |
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 125 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 34@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 20@20-100°C |
Physical Properties
| Element | Value |
|---|---|
| Density( gcm⁻³ ) | 7.3 |
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