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Indium/Silver Alloy Foil (In97/Ag3)

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Commodity: Alloys Material: Indium/Silver Form: Foil/Film/Sheet Composition: In 97/Ag 3 Thickness: 0.3mm
Indium Silver Alloy Foil (In97/Ag3) combines the softness and wetting ability of indium with the strength and tarnish resistance of silver in a thin, flexible sheet. This alloy balances ductility with improved mechanical stability, making it ideal for sealing, bonding, and microelectronic applications. Industries such as electronics, optics, and aerospace employ this foil in soldering layers, hermetic seals, and heat-spreading assemblies. Specific uses include wafer bonding in semiconductors, brazing in optical assemblies, and thin-layer diffusion barriers in microfabrication. Research applications explore stress–strain behavior, alloy phase stability, and development of low-temperature joining materials. The foil form enables uniform coverage and precision integration across sensitive surfaces. Its ability to merge structural reinforcement with indium’s bonding qualities makes it vital for advanced device engineering and high-performance material science research.
Starting at $306.00 each
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Material Properties

Mechanical Properties
Element Value
Hardness - Brinell 2
Tensile strength( MPa ) 5
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 7.5
Temperature coefficient( K⁻¹ ) -
Thermal Properties
Element Value
Melting point( C ) 143
Thermal conductivity( W m⁻¹ K⁻¹ ) 73@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 22@20-100°C
Physical Properties
Element Value
Density( gcm⁻³ ) 7.38
each

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Available Configurations

Properties common to all products in this list

Commodity: Alloys Material: Indium/Silver Form: Foil Composition: In 97/Ag 3 Thickness: 0.3mm

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Tolerances

Foil
Thickness <0.01mm ±25%
Thickness 0.01mm - 0.05mm ±15%
Thickness >0.05mm ±10%