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Grade: Haynes® 230
Formula: Ni 62/Cr 22/W 14/Mo 2
Form: Foil (Light Tight)
Material: Nickel/Chromium (Haynes®)
Commodity: Alloys
Light Tight: Light Tight

Haynes® 230 Foil (Light Tight)

Haynes® 230 Foil (Light Tight) is a nickel-chromium-tungsten-molybdenum alloy foil that combines the exceptional high-temperature and oxidation resistance of Haynes® 230 with a fully light-blocking property, ensuring no pinhole transmission. This unique combination makes it particularly valuable in environments requiring both thermal endurance and optical isolation. Its applications span aerospace, nuclear, and advanced electronics, where integrity against light exposure is crucial alongside structural performance. Specific technologies benefiting from Haynes® 230 light-tight foil include microstructural optimization in foil-gage materials, where controlled grain refinement enhances tensile strength and carbide distributions provide durability; flexible optoelectronic devices, where Haynes® 230 foils serve as stable substrates for active-matrix polymer light-emitting diode (PLED) displays; and precision packaging systems for sensitive optical or radiation-detection equipment, where its light-tight quality ensures signal fidelity. In research, Haynes® 230 light-tight foils advance studies on oxidation kinetics, creep performance, and substrate interactions in extreme environments. By merging total opacity with outstanding creep and oxidation resistance, Haynes® 230 Foil (Light Tight) establishes itself as a critical material at the intersection of high-temperature science, electronics, and optical engineering.

Health hazard/Hazardous to the ozone layer

Serious health hazard

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Material Properties for Alloys

Mechanical Properties
Element Value
Elongation at break( % ) 50
Modulus of elasticity( GPa ) 211
Tensile strength( MPa ) 860
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 125
Temperature coefficient( K⁻¹ ) -
Thermal Properties
Element Value
Melting point( C ) 1300-1370
Specific heat( J K⁻¹ kg⁻¹ ) 397@23°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 8.9@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 13@25-200°C
Physical Properties
Element Value
Density( gcm⁻³ ) 8.97

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