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Gold Ultrafine Wire

Available Configurations

Properties common to all products in this list

Commodity: Precious Metals Material: Gold Form: Wire Composition: Au CAS Number: 7440-57-5 Purity: 99.99% (4N) Temper: As Drawn
Diameter Length Other Variant
0.0015mm to 0.009mm 1m to 5m Standard spooled wire

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Gold Ultrafine Wire, under 9 μm in diameter, combines exceptional electrical conductivity, biocompatibility, and resistance to corrosion, making it indispensable in precision microelectronic and biomedical systems. Its ultra-fine gauge allows for high-density interconnects in semiconductor packaging, where gold alloy wires incorporating nickel, platinum, or palladium are used in flip-chip and wire bonding. It also plays a critical role in optoelectronics and fiber-optic sensing due to its low signal attenuation. Recent advances demonstrate its utility in mode-locked lasers via nonlinear optical absorption and in plasmonic enhancement for organic photovoltaics. Ultrafine gold nanowires also enable next-gen antennas in flexible electronics and ultra-stable 1D conductors in nano-optoelectronic design. As device architectures shrink, Gold Ultrafine Wire continues to support breakthroughs in data transmission, photonics, and implantable devices where material purity, precision, and miniaturization are paramount.
Starting at $1,290.00 each
No Minimum order Approx. 2 weeks leadtime Free technical support *Free delivery worldwide

Key Features

Gold wire possesses a combination of material characteristics that make it particularly well suited for electronics, aerospace, biomedical, and scientific applications:


Exceptional Chemical Inertness

Gold is highly resistant to oxidation and corrosion, maintaining chemical stability in a wide range of environments, including strong acids, alkalis, and oxidising gases. Its stability under aggressive conditions ensures long-term reliability in corrosive or reactive systems.


High Melting Point (1,064 °C)

With a high melting point of 1,064 °C, gold remains stable in extreme thermal conditions. This makes it ideal for high-temperature wiring in furnace thermocouples, soldering fixtures, and aerospace wiring harnesses.


High Density (19.32 g/cm³)

Gold's high density provides excellent structural stability, helping it resist stretching or deformation over time — even in ultra-thin gauges. This makes it ideal for precision applications like inductors, resonators, RF coil windings, and MEMS devices.


High Electrical Conductivity (22.14 nΩ·m)

Gold wire's excellent electrical conductivity ensures low resistivity, making it ideal for high-reliability electrical contacts, microelectronic interconnects, and bonding wires in semiconductor packages. Its stable performance minimises voltage drop and ensures consistent signal transmission.


Optical Reflectivity & Infrared Performance

Gold wire's excellent infrared reflectivity and optical stability support its use in photonic circuits, plasmonic waveguides, and near-field optical probes. These properties are valuable in nanoscale light manipulation, biosensing platforms, and high-resolution spectroscopy techniques.


Exceptional Ductility & Tensile Strength

Gold wire offers exceptional ductility and can achieve greater tensile strength through work-hardening. It withstands repeated bending and coiling without cracking, enabling reliable spring contacts, wire bonding, and flexible circuit interconnects.


Biocompatibility

Naturally bioinert and non-toxic, gold wire is used in implantable medical leads, neuroelectrodes, biosensor wiring, and even dental applications. It does not trigger adverse immune responses, making it suitable for prolonged contact with biological tissues and fluids.

Industrial Applications

High-purity gold wire is employed across high-technology sectors for its high electrical performance, chemical inertness, mechanical resilience, and biocompatibility:

Aerospace & Space Systems
Used in spacecraft wiring harnesses, thermocouple leads, and precision coil windings. Gold wire's resistance to oxidation, radiation, and vacuum environments ensures reliable power and signal transmission over long durations.
Electronics & Semiconductor Packaging
The industry standard for integrated circuit wire bonding, gold wire forms ultra-fine interconnects between chips and their external contacts. Its oxide-free surface and excellent weldability help ensure reliable connection in microprocessors, memory chips, and other advanced electronic devices.
RF & Microwave Engineering
Used in precision inductors, transformers, and RF coil windings for satellite communications and defence electronics. Its excellent conductivity and resistance to oxidation ensure stable performance at high frequencies.
Medical & Bioelectronic Devices
Used in pacemaker wires, neurostimulation electrodes, and biosensors. Gold wire's bioinertness, flexibility under repeated movement, and consistent conductivity enable safe, long-term use inside the body without adverse tissue reactions.
Scientific Instrumentation & Extreme Temperature Sensors
Used in thermocouples for stable temperature measurement in ultra-cold environments. Also employed as bonding wire in MEMS sensors and actuators, where durability through temperature changes and resistance to environmental degradation are essential.

Synonyms

Ultra-thin Gold Wire Fine Gold Wire

Material Properties

Atomic Properties
Element Value
Atomic number 79
Crystal structure Face centred cubic
Electronic structure Xe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown 1,3
Atomic weight( amu ) 196.9665
Thermal neutron absorption cross-section( Barns ) 98.8
Photo-electric work function( eV ) 4.8
Atomic radius - Goldschmidt( nm ) 0.144
Ionisation potential( No./eV ) 1/ 9.22
Ionisation potential( No./eV ) 2/ 20.5
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.42
Poisson's ratio 0.42
Bulk modulus( GPa ) 171
Bulk modulus( GPa ) 171
Tensile modulus( GPa ) 78.5
Tensile modulus( GPa ) 78.5
Hardness - Vickers( kgf mm⁻² ) 20-30
Hardness - Vickers( kgf mm⁻² ) 60
Tensile strength( MPa ) 130
Tensile strength( MPa ) 220
Yield strength( MPa ) 205
Yield strength( MPa ) -
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 2.20@20°C
Temperature coefficient( K⁻¹ ) 0.004@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.74
Physical Properties
Element Value
Boiling point( C ) 3080
Density( gcm⁻³ ) 19.3@20°C
Thermal Properties
Element Value
Melting point( C ) 1064.4
Latent heat of evaporation( J g⁻¹ ) 1738
Latent heat of fusion( J g⁻¹ ) 64.9
Specific heat( J K⁻¹ kg⁻¹ ) 129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 14.1@0-100°C
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Available Configurations

Properties common to all products in this list

Commodity: Precious Metals Material: Gold Form: Wire Composition: Au CAS Number: 7440-57-5 Purity: 99.99% (4N) Temper: As Drawn

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Tolerances

Wire
Diameter ±10%
Length +5% / -1%