Gold/Tin Alloy Spooled Wire (Au98/Sn2)

Gold/Tin Alloy Spooled Wire (Au98/Sn2) offers a near-pure gold matrix with a small percentage of tin, optimizing electrical conductivity while enhancing solderability and bond strength. This composition maintains gold’s exceptional corrosion resistance and ductility, while the tin addition improves wetting characteristics and joint reliability in microelectronic and optoelectronic packaging. It is extensively used in fine-pitch wire bonding for semiconductor devices, precision die attachment in photonics, and interconnection systems for aerospace-grade electronics where both electrical performance and long-term stability are paramount. The spooled wire format supports automated high-speed bonding, ensuring consistent diameter, smooth surface quality, and minimal contamination risk. In research, Au98/Sn2 wires are studied for their intermetallic phase behavior, low-resistance bonding in high-frequency circuits, and enhanced thermal fatigue resistance. The combination of high conductivity, metallurgical integrity, and process compatibility positions this alloy as a valuable material in both advanced industrial manufacturing and cutting-edge scientific applications.