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Formula: Au 80/Sn 20
Form: Foil/Film/Sheet
Material: Gold/Tin
Commodity: Precious Metals
Temper:
As Rolled
Gold/Tin Alloy Foil (Au80/Sn20) is a high-performance eutectic material valued for its high melting point, exceptional wetting characteristics, and resistance to oxidation, making it a preferred choice in microelectronics and optoelectronic packaging. Its composition provides a melting temperature near 280 °C, allowing for reliable soldering and brazing operations without flux, which minimizes contamination in sensitive components. This alloy is widely applied in hermetic sealing, chip attachment for semiconductor devices, and the assembly of photonic modules. Specific uses include Si and GaAs chip brazing, precision laser diode mounting, and gas-tight packaging for high-frequency microwave devices. In research, Au80/Sn20 foils are essential for investigating interfacial reactions in metal-semiconductor systems, optimizing thermal management in high-power devices, and developing advanced packaging strategies for harsh environments. The combination of metallurgical stability, superior joint strength, and compatibility with high-reliability systems underlines its critical role in scientific and industrial innovation.
Tolerances
Foil
| Thickness | <0.01mm | ±25% |
|---|---|---|
| Thickness | 0.01mm - 0.05mm | ±15% |
| Thickness | >0.05mm | ±10% |
Material Properties for Precious Metals
Thermal Properties
| Element | Value |
|---|---|
| Melting point( C ) | 280 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 57@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 16@20-100°C |
Mechanical Properties
| Element | Value |
|---|---|
| Shear strength( MPa ) | 270-280 |
| Tensile strength( MPa ) | 270-280 |
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