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Formula: Cu 98/Be 2
Form: Wire
Material: Copper/Beryllium
Commodity: Alloys
Temper: Hard
Coating: Gold Plated

Gold Plated Copper/Beryllium Alloy Spooled Wire (Cu98/Be2)

Gold Plated Copper/Beryllium Alloy Spooled Wire (Cu98/Be2) combines the strength and conductivity of copper-beryllium alloys with the surface stability and corrosion resistance of gold. This wire exhibits high tensile strength, low relaxation, and excellent resistance to fatigue and oxidation—key attributes in critical environments. Commonly used in aerospace, telecommunications, precision electronics, and defense systems, this material supports demanding applications such as signal contacts, spring connectors, and miniature switch components. The gold plating not only provides enhanced solderability but also extends the shelf life of the wire by preventing surface tarnish. With stable electrical performance over long durations and high temperatures, it is vital in the design of high-reliability connectors, especially in harsh or mission-critical environments. Research highlights its superior mechanical behavior under cyclical loads and its compliance with EU safety and recycling directives. This spooled form further facilitates automated manufacturing processes. Its combined structural integrity and electrical reliability underscore its enduring value in high-performance engineering and scientific advancement.

Acute toxicity

Serious health hazard

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Tolerances

Wire
Diameter ±10%
Length +5% / -1%

Material Properties for Alloys

Mechanical Properties
Element Value
Hardness - Brinell 100-360
Elongation at break( % ) 50
Modulus of elasticity( GPa ) 120-160
Tensile strength( MPa ) 500-1300
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 5.4-11.5
Temperature coefficient( K⁻¹ ) 0.001-0.0018
Thermal Properties
Element Value
Melting point( C ) 860-1000
Thermal conductivity( W m⁻¹ K⁻¹ ) 60-120@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 17@25-300°C
Physical Properties
Element Value
Density( gcm⁻³ ) 8.25

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