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Gold Pellets
Available Configurations
Properties common to all products in this list
| Purity | Maximum Lump Size | Weight |
|---|---|---|
| 99.99% (4N) to 99.999% (5N) | 4 mm to 6 mm | 1 g (0.0022 lbs) to 100 g (0.22 lbs) |
Need custom configurations? Please contact us.
Key Features
Gold Pellets are available in purities from 99.99% (4N) to 99.999% (5N), providing high-purity precious metal feedstock for thermal evaporation, electron beam evaporation, and alloying applications:
Pellet Geometry for Predictable Evaporation Behavior
The pellet form provides predictable melt behavior and repeatable charge loading for deposition rate consistency in thermal and electron beam evaporation systems, where irregular lump feedstock would introduce variability in melt dynamics and evaporation rate.
Melting Point 1,064 °C, Density 19.3 g/cm³
Gold’s relatively low melting point for a precious metal combined with high density makes it straightforward to evaporate in standard vacuum systems with resistive or electron beam sources, without the specialist high-temperature equipment required for platinum group metals.
Absolute Chemical Inertness
Gold does not oxidize, tarnish, or react with process environments, ensuring that deposited films and fabricated components maintain surface chemistry integrity throughout deposition, storage, and service.
Purity Range 4N to 5N
4N purity suits most PVD coating, metallization, and industrial alloying applications. 5N is selected wherever trace metallic contamination at the parts-per-million level would compromise device performance, surface chemistry, or electrochemical measurement integrity.
Electrical Resistivity 2.20 µΩ·cm, Thermal Conductivity 318 W/m·K
Well-characterized electrical and thermal properties make gold pellets a reliable feedstock for depositing conductive layers and metallization films where defined thin-film electrical performance is a specification requirement.
Industrial Applications
Gold Pellets are used wherever high-purity gold must be delivered in a controlled, consistent form for evaporation, alloying, or surface chemistry applications:
- ✦ Optical Coatings on Infrared Mirrors
- Used in physical vapour deposition of high-reflectivity gold coatings on infrared mirrors and optical components, where gold’s high reflectivity across the near- and mid-infrared and absolute chemical stability produce durable, contamination-free optical surfaces.
- ✦ Semiconductor and MEMS Metallization
- Applied as the evaporation source for gold metallization layers in semiconductor and MEMS device fabrication, where 5N purity controls trace impurity incorporation and the pellet geometry provides consistent deposition rate during batch processing.
- ✦ Biological Specimen Coating for Electron Microscopy
- Used for sputter or evaporation coating of biological specimens for scanning electron microscopy, where gold’s fine grain size in deposited films and chemical inertness minimize artifact introduction and provide a stable conductive coating on delicate biological surfaces.
- ✦ Electrochemical Electrode Fabrication and SERS Substrates
- High-purity pellets serve as source material for fabricating gold electrochemical working and reference electrodes and SERS-active substrates, where chemical inertness and purity underpin reproducible surface chemistry and electrode potential stability.
- ✦ Precise Alloy Formulation
- Applied in dental, electronics, and jewellery manufacturing for exact alloy composition control, where the pellet form and certified purity allow accurate weighing and controlled addition of gold to alloy melts.
Material Properties
| Element | Value |
|---|---|
| Atomic number | 79 |
| Crystal structure | Face centred cubic |
| Electronic structure | Xe 4f¹⁴ 5d¹⁰ 6s¹ |
| Valences shown | 1,3 |
| Atomic weight( amu ) | 196.9665 |
| Thermal neutron absorption cross-section( Barns ) | 98.8 |
| Photo-electric work function( eV ) | 4.8 |
| Atomic radius - Goldschmidt( nm ) | 0.144 |
| Ionisation potential( No./eV ) | 1/ 9.22 |
| Ionisation potential( No./eV ) | 2/ 20.5 |
| Element | Value |
|---|---|
| Material condition | Soft |
| Material condition | Hard |
| Poisson's ratio | 0.42 |
| Poisson's ratio | 0.42 |
| Bulk modulus( GPa ) | 171 |
| Bulk modulus( GPa ) | 171 |
| Tensile modulus( GPa ) | 78.5 |
| Tensile modulus( GPa ) | 78.5 |
| Hardness - Vickers( kgf mm⁻² ) | 20-30 |
| Hardness - Vickers( kgf mm⁻² ) | 60 |
| Tensile strength( MPa ) | 130 |
| Tensile strength( MPa ) | 220 |
| Yield strength( MPa ) | 205 |
| Yield strength( MPa ) | - |
| Element | Value |
|---|---|
| Electrical resistivity( µOhmcm ) | 2.20@20°C |
| Temperature coefficient( K⁻¹ ) | 0.004@0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C)( mV ) | 0.74 |
| Element | Value |
|---|---|
| Boiling point( C ) | 3080 |
| Density( gcm⁻³ ) | 19.3@20°C |
| Element | Value |
|---|---|
| Melting point( C ) | 1064.4 |
| Latent heat of evaporation( J g⁻¹ ) | 1738 |
| Latent heat of fusion( J g⁻¹ ) | 64.9 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 129@25°C |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 318@0-100°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 14.1@0-100°C |
Tolerances
| Maximum Lump Size | Nominal |
|---|