Gold/Germanium Eutectic Alloy Foil (Au88/Ge12)

Gold/Germanium Eutectic Alloy Foil (Au88/Ge12) offers a precisely controlled eutectic composition with a melting point around 356 °C, enabling highly reliable joining in microelectronics, optoelectronics, and high-vacuum assemblies. The thin foil form allows for uniform heat transfer and wetting during brazing, ensuring minimal void formation and strong hermetic seals. It exhibits excellent corrosion resistance, stable electrical conductivity, and superior wettability on metals such as nickel and gold, making it an ideal choice for die attachment, microcircuit sealing, and infrared detector packaging. Industries leveraging this foil include aerospace electronics, advanced sensing systems, and semiconductor manufacturing. Specific technologies benefiting from its properties include hermetic optoelectronic modules, precision MEMS packaging, and cryogenic device assembly. In research, Au88/Ge12 foil is widely used for studying phase transformations, solidification kinetics, and interface stability under thermal cycling, making it a cornerstone material for both advanced industrial fabrication and academic investigations in joining science.