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Formula: Au
Form: Disk
Material: Gold
CAS Number: 7440-57-5
Commodity: Precious Metals
Goodfellow supplies gold disks with a maximum purity of 99.999% (5N), ideal for applications requiring excellent conductivity, chemical stability, and biocompatibility. Gold is widely used in electronics, catalysis, and biomedical fields. Specific applications include connectors for integrated circuits, catalytic converters, and nanotechnology-based drug delivery systems. In research, it serves as a substrate for surface plasmon resonance studies and nanomaterial synthesis. Its unmatched properties make it invaluable for both scientific exploration and industrial applications. Gold’s role in enhancing the performance of electronic devices and medical implants highlights its importance in advancing modern technologies.
Technical Data Sheet Safety Data Sheet Tolerance Properties
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Tolerances

Disk
Thickness >0.05mm ±10%
Thickness <0.01mm ±25%
Thickness 0.01mm - 0.05mm ±15%

Material Properties for Precious Metals

Atomic Properties
Element Value
Atomic number 79
Crystal structure Face centred cubic
Electronic structure Xe 4f¹⁴ 5d¹⁰ 6s¹
Valences shown 1,3
Atomic weight( amu ) 196.9665
Thermal neutron absorption cross-section( Barns ) 98.8
Photo-electric work function( eV ) 4.8
Atomic radius - Goldschmidt( nm ) 0.144
Ionisation potential( No./eV ) 1/ 9.22
Ionisation potential( No./eV ) 2/ 20.5
Mechanical Properties
Element Value
Material condition Soft
Material condition Hard
Poisson's ratio 0.42
Poisson's ratio 0.42
Bulk modulus( GPa ) 171
Bulk modulus( GPa ) 171
Tensile modulus( GPa ) 78.5
Tensile modulus( GPa ) 78.5
Hardness - Vickers( kgf mm⁻² ) 20-30
Hardness - Vickers( kgf mm⁻² ) 60
Tensile strength( MPa ) 130
Tensile strength( MPa ) 220
Yield strength( MPa ) 205
Yield strength( MPa ) -
Electrical Properties
Element Value
Electrical resistivity( µOhmcm ) 2.20@20@20°C
Temperature coefficient( K⁻¹ ) 0.004@0-100°C
Thermal emf against Pt (cold 0C - hot 100C)( mV ) 0.74
Physical Properties
Element Value
Boiling point( C ) 3080
Density( gcm⁻³ ) 19.3@20°C
Thermal Properties
Element Value
Melting point( C ) 1064.4
Latent heat of evaporation( J g⁻¹ ) 1738
Latent heat of fusion( J g⁻¹ ) 64.9
Specific heat( J K⁻¹ kg⁻¹ ) 129@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 318@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 14.1@0-100°C

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