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Grade: DX845
Formula: PMP TPX®
Form: Foil/Film/Sheet
Material: Polymethylpentene (PMP, TPX™)
Commodity: Polymers
DX845 Polymethylpentene (PMP) Film offers targeted functionality for laboratory research and industrial applications in areas such as gas separation, microfluidics, and electrochemical membrane development. With selective gas permeability (notably for O₂ and CO₂), chemical resistance, and stable optical clarity (~88–90% transmittance), PMP is a thermoplastic polyolefin that supports precision applications in spectroscopy, diagnostics, and sensor housing. Commonly referred to as TPX™, its thermal tolerance up to 120 °C under load enables compatibility with heated environments and solvent exposure. The film’s moderate dielectric constant (~2.1–2.3) suits RF and high-frequency circuit testing. DX845 can be plasma-treated or chemically grafted for integration into modified ion-exchange systems, aiding R&D in energy interfaces and advanced polymer membranes. Its properties support reliable use in controlled experimental workflows and custom device fabrication.
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Tolerances

Foil/Film/Sheet
Thickness ±20%

Material Properties for Polymers

Chemical Resistance
Element Value
Acids - concentrated Good-Fair
Acids - dilute Good
Alcohols Good
Alkalis Good
Aromatic hydrocarbons Fair-Poor
Greases and Oils Good-Fair
Halogenated Hydrocarbons Fair-Poor
Halogens Fair-Poor
Ketones Good-Fair
Electrical Properties
Element Value
Dielectric constant @1MHz 2.12
Dissipation factor @ 1kHz 0.0002
Volume resistivity( Ohmcm ) >10¹⁶
Physical Properties
Element Value
Flammability HB
Refractive index 1.463
Resistance to Ultra-violet Poor
Limiting oxygen index( % ) 17
Water absorption - over 24 hours( % ) 0.01
Density( gcm⁻³ ) 0.835
Mechanical Properties
Element Value
Hardness - Rockwell R85
Elongation at break( % ) 15
Tensile modulus( GPa ) 1.5
Izod impact strength( J m⁻¹ ) 49
Tensile strength( MPa ) 25.5
Thermal Properties
Element Value
Heat-deflection temperature - 0.45MPa( C ) 100
Heat-deflection temperature - 1.8MPa( C ) 40
Lower working temperature( C ) 20
Upper working temperature( C ) 75-115
Specific heat( J K⁻¹ kg⁻¹ ) 2000
Thermal conductivity( W m⁻¹ K⁻¹ ) 0.17@23°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 117

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