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Grade: DX845
Formula: PMP TPX®
Form: Foil/Film/Sheet
Material: Polymethylpentene (PMP, TPX™)
Commodity: Polymers
TPX DX845 PMP film provides a unique combination of properties including high transparency, low density, excellent chemical resistance and outstanding electrical properties. A polymethylpentene (PMP) film, it is widely used in packaging applications where clarity and chemical inertness are critical. It is also used as a release film, capacitor dielectric and electrical insulator due to its dielectric strength and low dissipation factor. With a choice of 67 variations, our excellent range of DX845 PMP filmss allows you to select the optimal grade for your project.
Tolerances
Foil/Film/Sheet
| Thickness | ±20% |
|---|
Material Properties for Polymers
Chemical Resistance
| Element | Value |
|---|---|
| Acids - concentrated | Good-Fair |
| Acids - dilute | Good |
| Alcohols | Good |
| Alkalis | Good |
| Aromatic hydrocarbons | Fair-Poor |
| Greases and Oils | Good-Fair |
| Halogenated Hydrocarbons | Fair-Poor |
| Halogens | Fair-Poor |
| Ketones | Good-Fair |
Electrical Properties
| Element | Value |
|---|---|
| Dielectric constant @1MHz | 2.12 |
| Dissipation factor @ 1kHz | 0.0002 |
| Volume resistivity( Ohmcm ) | >10¹⁶ |
Physical Properties
| Element | Value |
|---|---|
| Flammability | HB |
| Refractive index | 1.463 |
| Resistance to Ultra-violet | Poor |
| Limiting oxygen index( % ) | 17 |
| Water absorption - over 24 hours( % ) | 0.01 |
| Density( gcm⁻³ ) | 0.835 |
Mechanical Properties
| Element | Value |
|---|---|
| Hardness - Rockwell | R85 |
| Elongation at break( % ) | 15 |
| Tensile modulus( GPa ) | 1.5 |
| Izod impact strength( J m⁻¹ ) | 49 |
| Tensile strength( MPa ) | 25.5 |
Thermal Properties
| Element | Value |
|---|---|
| Heat-deflection temperature - 0.45MPa( C ) | 100 |
| Heat-deflection temperature - 1.8MPa( C ) | 40 |
| Lower working temperature( C ) | 20 |
| Upper working temperature( C ) | 75-115 |
| Specific heat( J K⁻¹ kg⁻¹ ) | 2000 |
| Thermal conductivity( W m⁻¹ K⁻¹ ) | 0.17@23°C |
| Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 117 |
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